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Book Cover
E-journal
Author Electronics Systemintegration Technology Conference

Title Proceedings / Electronics Systemintegration Technology Conference
Published [Los Alamitos, Calif.] : IEEE, [2006-]
©2006-
Began with 1st (Sept. 5-7, 2006)
Online access available from:
IEEE Xplore    01 Jan. 2006-
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Copies

Description Online resource
Issuing Body Sponsored by IEEE Components, Packaging and Manufacturing Technology Society
Notes Description based on: 2nd (Sept. 1-4, 2008); title from PDF of title page (IEEExplore, viewed Jan. 21, 2009)
Latest issue consulted: 8th (2020) (IEEE Xplore website, viewed November 9, 2020)
Subject Electronic packaging -- Congresses
Microelectronics -- Congresses
Integrated circuits -- Congresses
Systems integration -- Congresses
Form Electronic journal
Author Institute of Electrical and Electronics Engineers
Components, Packaging & Manufacturing Technology Society
LC no. 2009242143
ISSN 2687-9727
2687-9700
ABBREV TI Proceedings (Electron. Syst. Tehcnol. Conf., Online)
OTHER TI Proceedings (Electronics Systemintegration Technology Conference. Online)
Other Titles ESTC
Title on IEEExplore conference web page: Electronics Systemintegration Technology Conference, ESTC