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Subjects (1-12 of 12)
Electronic packaging -- Congresses.
1
E-book
2013

ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems : July 16-18, 2013, Burlingame, California, USA


ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2013 : Burlingame, California, USA)
New York, N.Y. : American Society of Mechanical Engineers, 2013

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2
E-book
2015

ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems : collocated with the ASME 2015 13th International Conference on Nanoch


ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2015 : San Francisco, Calif.), creator
New York, N.Y. : American Society of Mechanical Engineers, 2015

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3
E-book
2017

ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Pro


ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2017 : San Francisco, Calif.), creator
New York, N.Y. : American Society of Mechanical Engineers, 2017

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4
E-book
2018

ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems : August 27-30, 2018, San Francisco, California, USA


ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2018 : San Francisco, Calif.), creator.
New York, N.Y. : American Society of Mechanical Engineers, 2018

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5
E-book
2014

Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31,


International Conference on Packaging and Manufacturing Technology (3rd : 2013 : Brisbane Australia)
[Zurich], Switzerland : Trans Tech Publications, [2014]

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6
E-book
2011

Components, packaging and manufacturing technology : selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology (ICCPMT 2010) Sanya, China,


International Conference on Components, Packaging and Manufacturing Technology (2010 : Sanya Shi, China)
Switzerland : Trans Tech Publications, 2011

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7
 
8
Book
1992

Electronic packaging : materials and processes to reduce package cycle time and improve reliability : proceedings of the 7th Electronic Materials and Processing Congress, 24-27 August 1992, Cambridge,


Electronic Materials and Processing Congress (7th : 1992 : Cambridge, Mass.)
Materials Park, OH : ASM International, [1992]

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Location Call no. Vol. Availability
 W'PONDS  621.381046 Ele/Epm 1992  AVAILABLE
9
E-book
2005

Microscale heat transfer : fundamentals and applications


NATO Advanced Study Institute on Microscale Heat Transfer - Fundamentals and Applications in Biological and Microelectromechanical Systems (2004 : Cesme-Izmir, Turkey)
Dordrecht : Springer in association with NATO Public Diplomacy Division, [2005]

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10
E-book
c2020

Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems 2019 : presented at ASME 2019 International Technical Con


ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2019 : Anaheim, Calif.)
New York : American Society of Mechanical Engineers, c2020

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11
E-book
2010

Proceedings of the ASME InterPack Conference--2009 : presented at 2009 ASME InterPack Conference : July 19-23, 2009, San Francisco, California, USA


ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems (2009 : San Francisco, Calif.)


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12
E-book
2012

Proceedings of the ASME Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS, and NEMS--2011 : presented at ASME 2011 Pacific Rim Techn


ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems (2011 : Portland, Or.)
New York : American Society of Mechanical Engineers, [2012]

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