| Description |
1 online resource (xii, 437 pages) : illustrations |
| Contents |
Introduction -- Nanotechnology -- Characterizations of Electrically Conductive Adhesives.-Isotropically Conductive Adhesives (ICAs) -- Anisotropically Conductive Adhesives/Films (ACA/ACF) -- NonConductive Adhesives/Films (NCA/NCF) -- Conductive Nano Inks -- Intrinsically Conducting Polymers (ICPs) -- Future Trends of Conductive Adhesive Technology |
| Summary |
Electrical Conductive Adhesives with Nanotechnologies begins with an overview of electronic packaging, discussing the various electrical adhesive options currently available. The book focuses extensively on Electrically Conductive Adhesives (ECAs), as well as other adhesives such as lead-free soldering, Isotropically Conductive Adhesives (ICAs), Anisotropically Conductive Adhesives/Films (ACA/ACFs) and Nonconductive Adhesives/Films (NCA/NCFs). The authors also present examples of how conductive adhesives can be applied to nano techniques, while making important mentions of recent research and development breakthroughs in the fields. Drawing upon tireless research, years of theoretical development and practical experience, and utilizing numerous visual examples and illustrative applications, authors CP Wong, Yi Li and Daniel Lu cover electrically conductive adhesives in depth, while also describing: The electrical properties, thermal performance, bonding pressure, assembly and reliability of numerous types of electrically conductive adhesives The similarities and differences between lead-free soldering techniques and electrically conductive adhesives, while also discussing the advantages of ECAs. Insights into the future of nano ECAs, as well as projections of future industry trends. Electrical Conductive Adhesives with Nanotechnologies is a must-read for both researchers and active engineers in the electronic packaging field |
| Bibliography |
Includes bibliographical references and index |
| Notes |
Print version record |
| Subject |
Electronic packaging.
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Solder and soldering.
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Adhesives -- Electric properties
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Nanostructured materials.
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Engineering.
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Nanostructures
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Engineering
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solder.
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engineering.
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TECHNOLOGY & ENGINEERING -- Electronics -- Microelectronics.
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TECHNOLOGY & ENGINEERING -- Electronics -- Digital.
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Ingénierie.
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Engineering
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Electronic packaging
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Nanostructured materials
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Solder and soldering
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| Form |
Electronic book
|
| Author |
Lu, Daniel.
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Wong, C. P., 1947-
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| ISBN |
9780387887838 |
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0387887830 |
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