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Subjects (1-33 of 33)
Electronic packaging.
1
E-book
2005

Adhesives technology for electronic applications : materials, processes, reliability


Licari, James J., 1930-
Norwich, NY : William Andrew Pub., [2005]

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2
E-book
2011

Adhesives technology for electronic applications : materials, processing, reliability


Licari, James J., 1930-
Amsterdam ; Boston : William Andrew Pub., 2011

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3
E-book
2013

Advanced flip chip packaging



New York ; London : Springer, 2013

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6
E-book
2018

ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems : August 27-30, 2018, San Francisco, California, USA


ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2018 : San Francisco, Calif.), creator.
New York, N.Y. : American Society of Mechanical Engineers, 2018

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7
E-book
2001

Copper interconnect technology


Steinbruchel, Christoph, author
Bellingham, Washington : SPIE Optical Engineering Press, 2001

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8
E-book
2009

Electrical conductive adhesives with nanotechnologies


Li, Yi (Grace Yi)
New York : Springer, 2009

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9
E-book
2019

Electronic enclosures, housings and packages


Süli, Frank, author
Duxford, United Kingdom : Woodhead Publishing, [2019]

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10
 
11
E-book
2022

Electronic packaging science and technology


Tu, K. N. (King-Ning), 1937- author.
Hoboken, NJ : Wiley, 2022

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12
E-book
2020

Electronic Scanned Array Design


Williams, John S.


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13
E-book
1999

Embedded Systems Design with 8051 Microcontrollers : Hardware and Software



Boca Raton, FL : CRC Press, 1999

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14
E-book
2014

Encyclopedia of thermal packaging.



New Jersey : World Scientific, 2014

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15
E-book
2013

Encyclopedia of thermal packaging. thermal packaging techniques


Garimella, S. V. (Suresh Venkata)
Singapore ; Hackensack, N.J. : World Scientific Pub. Co., [2013]

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16
Streaming video
2014

Food Factory: Series 1 - Ep 14



Australia : Discovery Science, 2014

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17
Streaming video
2014

Food Factory: Series 1 - Ep 17



Australia : Discovery Science, 2014

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19
E-book
2012

Hermeticity of electronic packages


Greenhouse, Hal.
Oxford : Elsevier ; Waltham, Mass. : William Andrew, 2012

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20
E-book
2000

Hermeticity of electronic packages


Greenhouse, Hal.
Park Ridge, N.J. : Norwich, N.Y. : Noyes Publications, [2000]

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21
E-book
1997

High temperature electronics



Boca Raton : CRC Press, ©1997

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22
E-book
2020

Lead-free soldering process development and reliability



Hoboken, NJ, USA : John Wiley & Sons, Inc., 2020

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23
E-book
2011

LED packaging for lighting applications : design, manufacturing, and testing


Liu, S. (Sheng), 1963-
Hoboken, N.J. : Wiley, 2011

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24
E-book
2017

Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging


Wei, Xing-Chang, author.
Boca Raton : CRC Press, Taylor & Francis Group, [2017]

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25
E-book
2010

Nano-bio-electronic, photonic and MEMS packaging



New York : Springer, [2010]

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26
E-book
2008

Nanopackaging : nanotechnologies and electronics packaging



New York : Springer, [2008]

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27
E-book
2012

Power electronic packaging : design, assembly process, reliability and modeling


Liu, Yong (Micro-optoelectronic mechanical systems professor)
New York : Springer, [2012]

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28
E-book
2016

Practical guide to the packaging of electronics : thermal and mechanical design and analysis


Jamnia, Ali, 1961- author.
Boca Raton : Taylor & Francis, CRC Press, 2016

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29
E-book
2010

Proceedings of the ASME InterPack Conference--2009 : presented at 2009 ASME InterPack Conference : July 19-23, 2009, San Francisco, California, USA


ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems (2009 : San Francisco, Calif.)


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30
E-book
2002

Reflow soldering processes and troubleshooting : SMT, BGA, CSP, and flip chip technologies


Lee, Ning-Cheng.
Boston ; Oxford : Butterworth-Heinemann Newnes, [2002]

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31
E-book
2019

RF and Microwave Module Level Design and Integration


Almalkawi, Mohammad, author
London : The Institution of Engineering and Technology, 2019

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32
E-book
2001

Run-to-run control in semiconductor manufacturing



Boca Raton : CRC Press, 2001

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33
E-book
2022

Thermal and structural electronic packaging analysis for space and extreme environments


Cepeda-Rizo, Juan, author.
Boca Raton, FL : CRC Press, 2022

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