Front cover; Preface; Editor; Editorial Board; Contributors; Contents; SECTION I: Fabrication and Technology; Chapter 1. Trends and Projections for the Future of Scaling and Future Integration Trends; Chapter 2. CMOS Circuits; Chapter 3. High-Speed, Low-Power Emitter Coupled Logic Circuits; Chapter 4. Price-Performance of Computer Technology; SECTION II: Memory and Storage; Chapter 5. Semiconductor Memory Circuits; Chapter 6. Semiconductor Storage Devices in Computing and Consumer Applications; SECTION III: Design Techniques; Chapter 7. Timing and Clocking
Chapter 8. Multiple-Valued Logic CircuitsChapter 9. FPGAs for Rapid Prototyping; Chapter 10. Issues in High-Frequency Processor Design; Chapter 11. Computer Arithmetic; SECTION IV: Design for Low Power; Chapter 12. Design for Low Power; Chapter 13. Low-Power Circuit Technologies; Chapter 14. Techniques for Leakage Power Reduction; Chapter 15. Dynamic Voltage Scaling; Chapter 16. Lightweight Embedded Systems; Chapter 17. Low-Power Design of Systems on Chip; Chapter 18. Implementation-Level Impact on Low-Power Design; Chapter 19. Accurate Power Estimation of Combinational CMOS Digital Circuits
Chapter 20. Clock-Powered CMOS for Energy-Efficient ComputingSECTION V: Testing and Design for Testability; Chapter 21. System-on-Chip (SoC) Testing: Current Practices and Challenges for Tomorrow; Chapter 22. Test Technology for Sequential Circuits; Chapter 23. Scan Testing; Chapter 24. Computer-Aided Analysis and Forecast of Integrated Circuit Yield; Index; Back cover
Summary
Fabrication and Technology. Memory and Storage. Design Techniques. Design for Low Power. Testing and Design for Testability
