| Description |
1 online resource (xx, 426 pages) : illustrations |
| Contents |
Introduction to Third Edition; Acknowledgments; Introduction to CD; 1 The Technical Introduction to the Third Edition; 1.1 The Wedge- and Ball-Bonding Machine Operations; 1.2 How to Approach Bonding Problems?; 1.2.1 Which Metals Can Be Ultrasonically Bonded?; 1.2.2 Assessing the Bondability and Reliability of Proposed New Bond Systems; 1.2.3 Some Unusual Uses of Wire Bonds; References; 2 Ultrasonic Bonding Systems and Technologies, Including a Description of the Ultrasonic Wire Bonding Mechanism; 2.1 Introduction; 2.2 Ultrasonic Transducer and Tool Vibration Modes |
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2.3 How Ultrasonic Bonds Are Made (Empirical Description)2.3.1. Brief Phenomenological Explanation of the Ultrasonic and Thermosonic Bonding Process; 2.4 Bonding with High(er) Frequency Ultrasonic Energy; 2.5 In-Process (Real-Time) Bond Monitoring; 2.6 Wire-Bonding Technologies; 2.6.1 Thermocompression Bonding; 2.6.2 Ultrasonic Wedge Bonding (Small- and Large-Diameter Wires); 2.6.3 Thermosonic Ball and Wedge Bonding; 2.6.4 Choosing a New/Different Wire-Bonding Technology; 2.7 Variations of Fine-Wire Bonding Technology; 2.7.1 Ribbon Wire Bonding; 2.7.2 Parallel Gap and Tweezer Welding |
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2.8 Major Chip Interconnection Alternatives to Wire Bonding (Flip Chip and TAB)2.8.1 Flip Chip; 2.8.2 Tape-Automated Bonding; 2.9 Wire-Bonding Technology: A Comparison and Future Directions; References; 3 Bonding Wire Metallurgy and Characteristics That Can Affect Bonding, Reliability, or Testing; 3.1 Introduction; 3.2 Stress-Strain Characteristics of Bonding Wires; 3.3 The Shelf-Life Aging of Bonding Wires; 3.4 General Discussion of Gold Bonding Wire; 3.5 Aluminum Wire for Ultrasonic Wedge Bonding; 3.6 Wire and Metallization Hardness |
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3.7 The Effect of EFO Polarity on Gold Wire and Its Metallurgy3.8 Metallurgical Fatigue of Bonding Wires; 3.9 Copper Wire for Ball Bonding; 3.10 Conductor Burn Out (Fusing); 3.10.1 Bonding Wires; 3.10.2 The Maximum Allowable Current for PCB and MCM Conductors; Appendix 3A; Appendix 3B; Conclusion; References; 4 Wire Bond Testing; 4.1 Introduction; 4.2 The Destructive Bond Pull Test; 4.2.1 Variables of the Bond Pull Test; 4.2.2 Peeling (Tweezer Pulling) for "Quality Tests" and Troubleshooting of Wedge Bonds and Crescent (Tail) Bonds |
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4.2.3 Failure Predictions That Are Based on Pull Test Data Must Have Confirmed Normality4.2.4 Effect of Metallurgy and Bonding Processes on the Bond Pull Force; 4.2.5 Effect of Wire Elongation on Bond Pull Force (Primarily for Large-Diameter Al, but also for Au Wire Used in Ball Bonding)[4-9]; 4.3 Ball-Bond Shear Test; 4.3.1 Introduction; 4.3.2 Apparatus; 4.3.3 A Manual Shear Probe As an Aid in Setting Up Ball Bonder (For Laboratory Use); 4.3.4 Interferences to Making Accurate Ball-Shear Test Measurements; 4.3.5 Ball-Shear Force versus Bonded Area |
| Summary |
Presenting a definitive resource on the critical process of connecting semiconductors with their packages; this authoritative guide covers every aspect of designing; manufacturing; and evaluating wire bonds engineered with cutting-edge techniques. -- Edited summary from book |
| Bibliography |
Includes bibliographical references and index |
| Notes |
English |
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Print version record |
| Subject |
Wire bonding (Electronic packaging) -- Production control
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Electronic packaging -- Reliability
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Electronic packaging -- Defects
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Semiconductors -- Failures.
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Microelectronics.
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Ultrasonic welding.
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Miniaturization
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microelectronics.
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ultrasonic welding.
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TECHNOLOGY & ENGINEERING -- Electronics -- Microelectronics.
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TECHNOLOGY & ENGINEERING -- Electronics -- Digital.
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Electronic packaging -- Defects
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Electronic packaging -- Reliability
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Microelectronics
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Semiconductors -- Failures
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Ultrasonic welding
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Wire bonding (Electronic packaging) -- Production control
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| Genre/Form |
Internet resources
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| Form |
Electronic book
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| ISBN |
9780071642651 |
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007164265X |
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9780071753135 |
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0071753133 |
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1282504908 |
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9781282504905 |
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9786612504907 |
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6612504900 |
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