Part I: From Thick Wafers to Ultra-Thin Silicon Chips; Chapter 1: Why Are Silicon Wafers as Thick as They Are?; Chapter 2: Thin Chips on the ITRS Roadmap; Part II: Thin Chip Fabrication Technologies; Chapter 3: Thin Wafer Manufacturing and Handling Using Low Cost Carriers; Chapter 4: Ultra-thin Wafer Fabrication Through Dicing-by-Thinning; Chapter 5: Thin Wafer Handling and Processing without Carrier Substrates; Chapter 6: Epitaxial Growth and Selective Etching Techniques; Chapter 7: Silicon-on-Insulator (SOI) Wafer-Based Thin-Chip Fabrication
Summary
Ultra-thin chips are the 'smart skin' of a conventional silicon chip. This book shows how very thin and flexible chips can be fabricated and used in many new applications in microelectronics, Microsystems, biomedical and other fields. It provides a comprehensive reference to the fabrication technology, post processing, characterization and the applications of ultra-thin chips