Book Cover
E-book

Title Ultra-thin chip technology and applications / Joachim N. Burghartz, editor
Published New York : Springer, ©2011

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Description 1 online resource (xxii, 467 pages) : illustrations (some color), color portraits
Contents Part I: From Thick Wafers to Ultra-Thin Silicon Chips; Chapter 1: Why Are Silicon Wafers as Thick as They Are?; Chapter 2: Thin Chips on the ITRS Roadmap; Part II: Thin Chip Fabrication Technologies; Chapter 3: Thin Wafer Manufacturing and Handling Using Low Cost Carriers; Chapter 4: Ultra-thin Wafer Fabrication Through Dicing-by-Thinning; Chapter 5: Thin Wafer Handling and Processing without Carrier Substrates; Chapter 6: Epitaxial Growth and Selective Etching Techniques; Chapter 7: Silicon-on-Insulator (SOI) Wafer-Based Thin-Chip Fabrication
Summary Ultra-thin chips are the 'smart skin' of a conventional silicon chip. This book shows how very thin and flexible chips can be fabricated and used in many new applications in microelectronics, Microsystems, biomedical and other fields. It provides a comprehensive reference to the fabrication technology, post processing, characterization and the applications of ultra-thin chips
Bibliography Includes bibliographical references and index
Notes English
Print version record
In Springer eBooks
Subject Integrated circuits -- Wafer-scale integration.
Integrated circuits -- Wafer-scale integration -- Design and construction
Systems engineering.
systems engineering.
computer-aided designs (visual works)
TECHNOLOGY & ENGINEERING -- Electronics -- Circuits -- General.
TECHNOLOGY & ENGINEERING -- Electronics -- Circuits -- Integrated.
Ingénierie.
Integrated circuits -- Wafer-scale integration
Integrated circuits -- Wafer-scale integration -- Design and construction
Form Electronic book
Author Burghartz, Joachim N.
ISBN 9781441972767
1441972765
9781441972750
1441972757
1299337600
9781299337602