High-Speed VLSI Interconnections; Contents; PREFACE; 1 Preliminary Concepts and More; 2 Parasitic Resistances, Capacitances, and Inductances; 3 Interconnection Delays; 4 Crosstalk Analysis; 5 Electromigration-Induced Failure Analysis; 6 Future Interconnections; INDEX
Summary
This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections. In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk. Each chapter is designed to exist independently or as a par
