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Book Cover
E-journal
Author International Conference on Thermal Issues in Emerging Technologies, Theory and Applications

Title Proceedings / ThETA ... International Conference on Thermal Issues in Emerging Technologies, Theory and Applications
Published Piscataway, NJ : Institute of Electrical and Electronics Engineers
Began with 1st (Jan. 3/6, 2007)
Online access available from:
IEEE Xplore    01 Jan. 2007-
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Description Online resource
Notes Description based on first issue; title from PDF of cover (IEEExplore, viewed Oct. 27, 2008)
Subject Heat -- Transmission -- Congresses
Microelectronics -- Congresses
Electronic apparatus and appliances -- Thermal properties -- Congresses
Electronic apparatus and appliances -- Temperature control -- Congresses
Heat engineering -- Congresses
Form Electronic journal
Author Institute of Electrical and Electronics Engineers
LC no. 2008242316
ISSN 1949-1700
1949-1697
ABBREV TI Int. Conf. Therm. Issues Emerg. Technol. Theory Appl. (Online)
OTHER TI International Conference on Thermal Issues in Emerging Technologies, Theory and Applications (Online)
Other Titles Title on IEEExplore conference web page: Thermal Issues in Emerging Technologies, Theory and Applications, ThETA, International Conference on
Also called: Proceedings of the ... International Conference on Thermal Issues in Emerging Technologies, Theory and Applications