| Description |
1 online resource (xii, 349 pages) : illustrations |
| Series |
Selected topics in electronics and systems ; vol. 29 |
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Selected topics in electronics and systems ; v. 29.
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| Contents |
Preface; CONTENTS; Present and Future of High-Speed Compound Semiconductor IC's; 1. Introduction; 2. Fundamentals of Lightwave Communication ICs; 3. Device Technology; 4. Fundamentals of High-Speed Digital IC Design; 5. Mixed Signal Issues in High Speed IC Design; 6. Future Trends and Subjects; 7. Conclusions; References; A Comparison of Silicon and III-V Technology Performance and Building Block Implementations for 10 and 40 Gb/s Optical Networking ICs; 1. Introduction; 2. Semiconductor Technologies; 3. Building Blocks; 4. Technology Choices; 5. Examples of 10 and 40 Gb/s Circuits |
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6. ConclusionsReferences; The Transforming MMIC; 1. Introduction; 2. Transforming MMICs through Innovations in Compound Semiconductor Materials; 3. Transforming Architectures for Real-time Adaptability; 4. Conclusions; Reference; Metamorphic Low Noise Amplifiers and Optical Components; 1. Introduction; 2. Material Properties; 3. Device Processing and Low Noise DC Performance; 4. Low Noise Devices And Circuits; 5. Power Devices; 6. Metamorphic Optical Devices and Circuits; 7. Reliability; 8. Conclusion; References; GaAs PHEMT Chip Sets and IC Processes for High-End Fiber Optic Applications |
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1. Introduction2. PHEMT and MHEMT Processes; 3. Optical Fibre Interface Circuits; 4. 2.5 Gb/s Transimpedance Amplifiers; 5. 40Gb/s Transimpedance Amplifier; 6.10 Gb/s Laser Drivers; 7. 40Gb/s Modulator Drivers; 8.43 Gb/s Multiplexers and Demultiplexers; 9. Future Performance of Fiber Optic IC's and Related Processes; 10. Conclusion; References; Distributed Amplifier for Fiber-Optic Communication Systems; 1. Introduction; 2. Conventional Distributed Amplifier Design; 3. LiNbO3 Modulator Driver (LNDRV); 4. NRZ-Preamplifier; 5. RZ-Preamplifler; 6. Over-40-Gb/s amplifier; 7. Conclusion |
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3. Trench Photodiodes4. Key Passive Elements for High-Frequency Operation; 5. Substrate Effects in RF and Microwave IC Designs; 6. Summary; References; High-Speed Low-Power Digital and Analog Circuits Implemented in IBM SiGe BiCMOS Technology; 1. Introduction; 2. Circuit design methodology; 3. Measured performance results from the first 5HP fabrication run; 4. Measured performance results from the second 5HP fabrication run; 5. Measured and simulated performance results on the first 7HP fabrication run; 6. Circuits placed on second 7HP fabrication run; 7. SiGe BiCMOS applications; 8. Summary |
| Summary |
Annotation Book version of a special issue of the International Journal of High Speed Electronics and Systems, reviewing recent work in the field of compound semiconductor integrated circuits |
| Bibliography |
Includes bibliographical references |
| Notes |
English |
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Print version record |
| Subject |
Compound semiconductors.
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Integrated circuits.
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TECHNOLOGY & ENGINEERING -- Electronics -- Solid State.
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TECHNOLOGY & ENGINEERING -- Electronics -- Semiconductors.
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Compound semiconductors
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Integrated circuits
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| Form |
Electronic book
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| Author |
Vu, T. T. (Tho T.)
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| ISBN |
9789812796844 |
|
9812796843 |
|
9789812383112 |
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9812383115 |
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1281947865 |
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9781281947864 |
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9786611947866 |
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6611947868 |
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