| Description |
1 online resource (xxii, 590 pages) : illustrations |
| Series |
Wiley-Scrivener ; v.48 |
|
Wiley-Scrivener
|
| Contents |
Fundamentals. Surface and Colloidal Chemical Aspects of Wet Cleaning / Srini Raghavan, Manish Keswani, Nandini Venkataraman -- The Chemistry of Wet Cleaning / D Martin Knotter -- The Chemistry of Wet Etching / D Martin Knotter -- Surface Phenomena: Rinsing and Drying / Karen A Reinhardt, Richard F Reidy, John A Marsella -- Fundamental Design of Chemical Formulations / Robert J Rovito, Michael B Korzenski, Ping Jiang, Karen A Reinhardt -- Filtering, Recirculating, Reuse, and Recycling of Chemicals / Barry Gotlinsky, Kevin T Pate, Donald C Grant -- Applications. Cleaning Challenges of High-k/Metal Gate Structures / Muhammad M Hussain, Denis Shamiryan, Vasile Paraschiv, Kenichi Sano, Karen A Reinhardt -- High Dose Implant Stripping / Karen A Reinhardt, Michael B Korzenski -- Aluminum Interconnect Cleaning and Drying / David J Maloney -- Low-k/Cu Cleaning and Drying / Karen A Reinhardt, Richard F Reidy, Jerome Daviot -- Corrosion and Passivation of Copper / Darryl W Peters -- Germanium Surface Conditioning and Passivation / Sonja Sioncke, Yves J Chabal, Martin M Frank -- Wafer Reclaim / Michael B Korzenski, Ping Jiang -- Direct Wafer Bonding Surface Conditioning / Hubert Moriceau, Yannick C Le Tiec, Frank Fournel, Ludovic F L Ecarnot, Sebastien L E Kerdil̈s, Daniel Delprat, Christophe Maleville -- New Directions. Novel Analytical Methods for Cleaning Evaluation / Chris M Sparks, Alain C Diebold -- Stripping and Cleaning for Advanced Photolithography Applications / John A Marsella, Dana L Durham, Leslie D Molnar |
| Summary |
This comprehensive volume provides an in-depth discussion of the fundamentals of cleaning and surface conditioning of semiconductor applications such as high-k/metal gate cleaning, copper/low-k cleaning, high dose implant stripping, and silicon and SiGe passivation. The theory and fundamental physics associated with wet etching and wet cleaning is reviewed, plus the surface and colloidal aspects of wet processing. Formulation development practices and methodology are presented along with the applications for preventing copper corrosion, cleaning aluminum lines, and other sensitive layers. This |
| Bibliography |
Includes bibliographical references and index |
| Notes |
Copyright © John Wiley and Sons 2011 |
|
English |
|
Print version record |
| Subject |
Semiconductors -- Surfaces -- Cleaning
|
|
Surface preparation.
|
|
TECHNOLOGY & ENGINEERING -- Electronics -- Semiconductors.
|
|
TECHNOLOGY & ENGINEERING -- Electronics -- Solid State.
|
|
Engineering
|
| Form |
Electronic book
|
| Author |
Reidy, Richard F., 1960-
|
| LC no. |
2011275120 |
| ISBN |
9781613441770 |
|
1613441770 |
|
9781118071731 |
|
1118071735 |
|
0470625953 |
|
1118071743 |
|
9780470625958 |
|
9781118071748 |
|
1118099516 |
|
9781118099513 |
|
1283374595 |
|
9781283374590 |
|
9786613374592 |
|
6613374598 |
|
