| Description |
1 online resource (712 pages) : illustrations |
| Series |
Materials Science Forum, 1662-9752 ; Volume 815 |
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Materials science forum ; v. 815.
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| Contents |
Advanced Functional Materials; Preface; Table of Contents; Symposium E: Materials in Microelectronic and Optoelectronic Industry; Process Control of Buried Layer Epitaxy by Barrel Type Furnace; Ru Thin Film Formation Using Oxygen Plasma Enhanced ALD and Rapid Thermal Processing; Research on Surface Roughness of Acid Etched Silicon Wafers; Investigation of Chemical Vapor Deposited Graphene Film on Oxide Substrate; Ultrahigh Purity Copper Alloy Target Used Innanoscale ULSI Interconnects; Property of an AlGaN/GaN MIS Diode with Si3N4/Al2O3 Bilayer Gate Dielectric Films |
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A New Type of Self-Aligned Technology for RF and Microwave Graphene Field-Effect TransistorsElectron Beam Annealing for Component Optimization in Si-Sb-Te Material; Structures and Electronic Properties of a Si55 Cluster on DFTB Calculations; Surface Plasmon Enhanced Photoluminescence of the Rubrene Film by Silver Nanoparticles; Development of Precious Metal and its Alloy Sputtering Targets with High Performance; Rheological and Thermomechanical Properties of Meso and Non-Porous Silica Filled Epoxy Composites; Study of Black Center in Silicon Wafer for Solar Cell |
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Impurity Detection Method for High-Purity BCl3First-Principles Study on Electronic and Optical Properties of Kesterite and Stannite Cu2ZnSnS4 Photovoltaic Absorbers; Effect of Acetic Acid/Water Ratio on the Microstructure and Properties of LaNiO3 Thin Films by Metal Organic Solution Deposition; Symposium F: Electronic Materials; Effects of Cobalt Nanoparticles Addition on Shear Strength, Wettability and Interfacial Intermetallic Growth of Sn-3.0Ag-0.5Cu Solder during Thermal Cycling |
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Nickel Nanoparticles Mediated Growth of the Intermetallic Compound between Sn-1.0Ag-Xni Solders Alloy and Cu SubstrateEffect of Bi Addition on Microstructures, Properties and Interfacial Intermetallic Compound Growth of Low-Ag Sn-Cu Lead-Free Solder; Influence of Dislocation Density on Micromechanical Characteristics of Cu6Sn5 and Cu3Sn; Microstructure and Dielectric Properties of (Ba, Ta) Co-Doped Sr2Nb2O7 Ceramics; Effect of Ag Addition on Growth of the Interfacial Intermetallic Compounds between Sn-0.7Cu Solder and Cu Substrate |
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Ferroelectric and Photovoltaic Properties of Mn-Doped Bismuth Ferrite Thin FilmsMagnetic Properties and Unusual Morphologies of Barium Ferrites Prepared by Electrospinning and Sol-Gel Auto-Combustion Method; Symposium G: Multiferroic Materials; Effects of Sm and Mn Co-Doping on Structural and Optical Properties of BiFeO3 Thin Films Prepared by Sol-Gel Technique; Effects of Ba and Ti Codoping on Stoichiometric and Nonstoichiometric BiFeO3 Multiferroic Ceramics; A Review on the Characteristics of the New Multiferroic Three-Ply Structure Ferroelectric-Ferromagnetic Nanocomposite |
| Summary |
Collection of selected, peer reviewed papers from the Chinese Materials Congress 2014 (CMC 2014), July 4-7, 2014, Chengdu, China. The 127 papers are grouped as follows: Symposium E: Materials in Microelectronic and Optoelectronic Industry; Symposium G: Multiferroic Materials; Symposium H: Smart Materials; Symposium I: Vanadium-Titanium And Rare Earth Functional Materials; Symposium J: Biomedical Materials; Symposium K: High Performance And Functional Polymer and Composite Materials |
| Bibliography |
Includes bibliographical references at the end of each chapters and indexes |
| Notes |
Online resource; title from PDF title page (ebrary, viewed April 25, 2015) |
| Subject |
Electronics -- Materials -- Congresses
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Smart materials -- Research -- Congresses
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Rare earths -- Research -- Congresses
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Biomedical materials -- Research -- Congresses
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Composite materials -- Research -- Congresses
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Polymers -- Research -- Congresses
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Biomedical materials -- Research
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Composite materials -- Research
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Electronics -- Materials
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Polymers -- Research
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Smart materials -- Research
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| Genre/Form |
Conference papers and proceedings
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| Form |
Electronic book
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| Author |
Han, Yafang, editor.
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Gu, Zhongwei, editor.
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Fu, Qiang, 1963- editor.
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| ISBN |
3038267805 |
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9783038267805 |
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