| Description |
x, 613 pages : illustrations ; 25 cm |
| Series |
NATO ASI series. Series E., Applied sciences ; vol. 336 |
|
NATO ASI series. Series E, Applied sciences ; no. 336
|
| Contents |
Machine derived contents note: Preface. Plasma Etching: Introduction to Plasma Etching; T.D. Mantei. Plasma Chemistry, Basic Processes and PECVD; D.L. Flamm. The Role of Ions in Reactive Ion Etching with Low Density Plasmas; J.W. Coburn. SiO2 Etching in High-Density Plasmas: Differences with Low-Density Plasmas; G.S. Oehrlein. Plasma Deposition: Introduction to Plasma Enhanced Chemical Vapor Deposition; T.S. Cale, et al. Topography Evolution During Semiconductor Processing; T.S. Cale, et al. Deposition of Amorphous Silicon; J. Perrin. Plasma Sources: High Density Sources for Plasma Etching; T.D. Mantei. Resonant Plasma Excitation by Electron Cyclotron Waves Fundamentals and Applications; H. Oechsner. The Transition from Capacitive to Inductive to Wave Sustained Discharges; R.W. Boswell, et al. Physics of Surface-Wave Discharges; J. Margot, M. Moisan. Plasma-Surface Interactions: Surface Science Aspects of Etching and Wall Reactions in High Density Plasmas; J.W. Coburn. Plasma-Surface Interactions; R. d'Agostino. Cl2 Plasma-Si Surface Interactions in Plasma Etching; V.M. Donnelly, et al. Numerical Modeling: Particle in Cell Monte Carlo Collision Codes (PIC-MCC), Methods and Applications to Plasma Processing; J.-P. Boeuf, A. Merad. Plasma Diagnostics: Optical Diagnostics of Processing Plasmas; P.F. Williams. Optical Diagnostics of Plasmas: A Tool for Process Control; N. Sadeghi, et al. Infrared Absorption Spectroscopy as a Diagnostic for Processing Plasmas; G.M.W. Kroesen. Ellipsometric Analysis of Plasma Deposited and Plasma Etched Materials; J.A. Woollam. Mass Spectrometry of Reactive Plasmas; J. Perrin. Less Conventional Processing Applications of Plasmas: Deposition of Silicon Dioxide Films Using the Helicon Diffusion Reactor for Integrated Optics Applications; R.W. Boswell, et al. Remote Plasma Processing; G.S. Oehrlein. Magnetized Surface-Wave Discharges for Submicrometer Pattern Transfer; J. Margot, et al. Dusty Plasmas: Fundamental Aspects and Industrial Applications; G.M.W. Kroesen. Industrial Application of Plasmas for Processing: Low Energy Plasma Beams for Semiconductor Technology; H. Oechsner. Process Control Concepts; S. Watts Butler. Issues and Solutions for Applying process Control to Semiconductor Manufacturing; S. Watts Butler. Index |
| Notes |
"Proceedings of the NATO Advanced Study Institute on Plasma Processing of Semiconductors, Château de Bonas, France, 17-18-June, 1996"--T.p. verso |
|
"Published in cooperation with the NATO Scientific Affairs Division." |
| Bibliography |
Includes bibliographical references and index |
| Subject |
Plasma chemistry -- Industrial applications.
|
|
Plasma engineering.
|
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Plasma etching -- Industrial applications.
|
|
Semiconductors -- Etching.
|
| Genre/Form |
Conference papers and proceedings.
|
| Author |
Williams, P. F. (P. Frazer)
|
|
North Atlantic Treaty Organization. Scientific Affairs Division.
|
| LC no. |
97016609 |
| ISBN |
0792345673 (acid-free paper) |
|
