| Description |
1 online resource (300 pages) |
| Series |
Reviews of accelerator science and technology ; v. 4 |
|
Reviews of accelerator science and technology ; v. 4
|
| Contents |
1.3. Overview of article2. Nuclear IBA Depth Profiling Methods; 2.1. Energy loss; 2.2. Rutherford backscattering spectrometry; 2.3. Elastic (non-Rutherford) backscattering; 2.4. Elastic recoil detection; 2.5. Nuclear reaction analysis; 3. Other IBA Methods; 3.1. Crystalline damage and impurities; 3.2. Catalysis and related studies (LEIS); 3.3. Surface reconstruction studies (MEIS); 3.4. Sputtering methods (SIMS); 3.5. Electrical characterisation (IBIC); 4. Particle-Induced X-Ray Emission; 4.1. Energy Loss (STIM); 4.2. Ionisation cross-section; 4.3. Fluorescence probability |
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10.4. Photoresist "freezing" for lithography11. Photovoltaics Doping; 12. Semiconductor Process Issues; 12.1. Particles; 12.2. Charging; 12.3. Photoresists; 13. Materials Modification Applications and Process E.ects; 13.1. H-cut wafer splitting; 13.2. Phase stabilization implants for NiSi contacts; 14. Summary; Acknowledgments; References; Ion Beam Analysis: A Century of Exploiting the Electronic and Nuclear Structure of the Atom for Materials Characterisation Chris Jeynes, Roger P. Webb and Annika Lohstroh; 1. Introduction; 1.1. Scope of chapter; 1.2. Complementary techniques |
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4.1.4. Hydrogel wound dressings and face masks4.2. Curing of surface coatings and printing inks by electron beam accelerators; 4.3. Radiation-induced grafting of polymers; 5. Food Irradiation; 6. Sterilization of Medical Products and Food and Beverage Packaging; 7. Application for Environmental Conservation; 7.1. Cleaning industrial flue gases by the use of electron beams; 7.1.1. Technology of cleaning flue gas and reaction mechanism; 7.1.2. Industrial application of the technology; 7.1.3. Advantages of the technology; 7.2. Cleaning of industrial waste water by the electron accelerator |
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8. Conclusion: Challenges of Electron Beam Accelerator ApplicationsReferences; Ion Implantation for Semiconductor Doping and Materials Modification Lawrence A. Larson, Justin M. Williams and Michael I. Current; 1. Introduction; 2. Dose and Energy Ranges; 3. Implanter Machine Types; 4. Doping Planar CMOS Transistors; 5. System on a Chip (SOC) Doping; 6. Doping of Non-Planar CMOS Transistors; 7. PV Doping; 8. Ion Types; 9. Ion Implantation Machines; 10. Advanced Semiconductor Processes; 10.1. Shallow junction SDE; 10.2. Junction leakage; 10.3. Mobility enhancing strain |
| Notes |
4.4. Mass absorption coefficient |
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Editorial Preface; Trends for Electron Beam Accelerator Applications in Industry Sueo Machi; 1. Introduction: History of Electron Accelerator Applications; 2. Trends of Accelerators for Radiation Processing Applications [2]; 3. Economic Scale of Radiation Applications in Comparison with the Use of Nuclear Energy to Produce Electrical Power; 4. Application of Electron Accelerators in the Polymer Industry; 4.1. Cross-linking of polymers to improve properties; 4.1.1. Automobile tires; 4.1.2. Wire and cable; 4.1.3. Heat-shrinkable tubes and films |
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Print version cataloged as a continuing resource by Library of Congress |
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Online resource; title from digital title page (viewed on Aug. 8, 2012) |
| Subject |
Particle accelerators -- Industrial applications.
|
| Form |
Electronic book
|
| Author |
Chao, Alexander Wu.
|
|
Chou, Weiren.
|
| ISBN |
9789814383998 |
|
9814383996 |
|
