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Author
IEEE Far East Forum on Nondestructive Evaluation/Testing: New Technology & Application
Title
Proceedings ... / IEEE Far East Forum on Nondestructive Evaluation/Testing : New Technology and Application
Published
Piscataway, NJ : IEEE
Online access available from:
IEEE Xplore
01 Jan. 2013-
View Resource Record
Copies
Description
Online resource
Notes
Description based on: 11th (2014); title from title page
Latest issue consulted: 11th (2014)
Subject
Nondestructive testing -- Technological innovations -- Congresses
Form
Electronic journal
Author
Institute of Electrical and Electronics Engineers
LC no.
2017205633
ISSN
2639-4944
ABBREV TI
Proc. (IEEE Far East Forum Nondestruct. Eval./Test, New Technol. Appl
OTHER TI
Proceedings (IEEE Far East Forum on Nondestructive Evaluation/Testing, New Technology & Application)
Other Titles
Increasingly perfect NDT/E
FENDT ..
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