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E-journal
Author IEEE Far East Forum on Nondestructive Evaluation/Testing: New Technology & Application

Title Proceedings ... / IEEE Far East Forum on Nondestructive Evaluation/Testing : New Technology and Application
Published Piscataway, NJ : IEEE
Online access available from:
IEEE Xplore    01 Jan. 2013-
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Description Online resource
Notes Description based on: 11th (2014); title from title page
Latest issue consulted: 11th (2014)
Subject Nondestructive testing -- Technological innovations -- Congresses
Form Electronic journal
Author Institute of Electrical and Electronics Engineers
LC no. 2017205633
ISSN 2639-4944
ABBREV TI Proc. (IEEE Far East Forum Nondestruct. Eval./Test, New Technol. Appl
OTHER TI Proceedings (IEEE Far East Forum on Nondestructive Evaluation/Testing, New Technology & Application)
Other Titles Increasingly perfect NDT/E
FENDT ..