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Book Cover
E-book
Author Dziuban, J. A. (Jan A.)

Title Bonding in microsystem technology / J.A. Dziuban
Published [Dordrecht] : Springer, ©2006

Copies

Description 1 online resource (xviii, 331 pages) : 296 figure
Series Springer series in advanced microelectronics, 1437-0387 ; 24
Springer series in advanced microelectronics ; 24. 1437-0387
Contents Some Remarks on Microsystem Systematics and Development -- Deep, Three-Dimensional Silicon Micromachining -- Bonding -- Classification of Bonding and Closing Remarks
Summary Bonding in Microsystem Technology starts with descriptions of terminology, kinds of microsystems and market analysis. Followed by the presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process flow-charts and applications of basic micromechanical structures in microsystems are shown. Next, high-temperature, low temperature and room-temperature bonding and their applications in microsystem technology are presented. The following part of the book contains the detailed description of anodic bonding, starting from analysis of properties of glasses suitable for anodic bonding, and discussion of the nature of the process. Next all types of anodic bonding and sealing procedures used in microsystem technology are presented. This part of the book finishes with examples of applications of anodic bonding in microsystem technology taken from the literature but mainly based on the author's personal experience
Analysis engineering
mechanica
mechanics
materialen
materials
elektronica
electronics
instrumentatie
instrumentation
optische instrumenten
optical instruments
fysica
physics
optica
optics
Engineering (General)
Techniek (algemeen)
Bibliography Includes bibliographical references and index
Notes English
Print version record
In Springer e-books
Subject Microtechnology.
Micromachining.
TECHNOLOGY & ENGINEERING -- Electronics -- Microelectronics.
TECHNOLOGY & ENGINEERING -- Electronics -- Digital.
Micromachining.
Microtechnology.
Ingénierie.
Micromachining
Microtechnology
Form Electronic book
ISBN 9781402045899
1402045891
9781402045783
1402045786