| Description |
1 online resource |
| Series |
Adhesion and Adhesives: Fundamental and Applied Aspects |
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Adhesion and adhesives. Fundamental and applied aspects
|
| Contents |
Half Title page; Title page; Copyright page; Preface; Acknowledgements; Part 1: Adhesion: Fundamentals and Measurement; Chapter 1: Study of Molecular Bonding or Adhesion by Inelastic Electron Tunneling Spectroscopy, with Special Reference to Microelectronics; 1.1 Introduction; 1.2 Principles of IETS; 1.3 Application of IETS in Microelectronics; 1.4 Prospects; 1.5 Summary; References; Chapter 2: Adhesion Measurement of Thin Films and Coatings: Relevance to Microelectronics.; 2.1. Introduction; 2.2 Mechanical Methods; 2.3 Laser Based Techniques; 2.4 Summary and Remarks; References |
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Part 2: Ways to Promote/Enhance AdhesionChapter 3: Tailoring of Interface/Interphase to Promote Metal-Polymer Adhesion; 3.1 Introduction; 3.2 New Concepts for Ideal Design of Metal-Polymer Interfaces with Covalently Bonded Flexible Spacer Molecules; 3.3 Situation at Al Oxide/Hydroxide Surfaces Using Aluminium as Substrate; 3.4. Adhesion Promotion by Non-specific Functionalization of Polyolefin Surfaces; 3.5 Methods for Producing Monosort Functional Groups at Polyolefin Surfaces; 3.6 Reactions and Bond Formation at the Interface; 3.7 Grafting of Spacer Molecules at Polyolefin Surfaces |
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3.8 Summary and ConclusionsAcknowledgement; References; Chapter 4: Atmospheric and Vacuum Plasma Treatments of Polymer Surfaces for Enhanced Adhesion in Microelectronics Packaging; 4.1 Introduction; 4.2 Plasma Fundamentals; 4.3 Survey of Vacuum Plasma Treatment of Polymers; 4.4 Survey of Atmospheric Pressure Plasma Treatment of Polymers; 4.5 Atmospheric Pressure Plasma Activation of Polymer Materials Relevant to Microelectronics; 4.6 Vacuum Versus Atmospheric Plasmas for Use in Semiconductor Packaging; References |
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Chapter 5: Isotropic Conductive Adhesive Interconnect Technology in Electronics Packaging Applications5.1 Introduction; 5.2 ICA Technology; 5.3 Technology Reviews; 5.4 Electrical Properties; 5.5 Mechanical Properties; 5.6 Thermal Properties; 5.7 Metallic Filler; 5.8 Polymer Materials; 5.9 Reliability; 5.10 Dispensation; 5.11 Environmental Properties; 5.12 Other Results; 5.13 Summary; 5.14 Prospects; References; Part 3: Reliability and Failure Mechanisms; Chapter 6: Role of Adhesion Phenomenon in the Reliability of Electronic Packaging; 6.1 Introduction; 6.2 Hierarchy of Electronic Packaging |
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6.3 Substrates, Carriers, and Laminates6.4 Flexible Laminates; 6.5 First Level Packaging /Semiconductor Packaging; 6.6 Second Level Packaging; 6.7 Reliability Enhancements; 6.8 Thermal Management; 6.9 Summary; Acknowledgements; References; Chapter 7: Delamination and Reliability Issues in Packaged Devices; 7.1 Introduction; 7.2 Basic Aspects of Delamination Failure; 7.3 Evaluation of Delamination Initiation in Electronic Packages; 7.4 Evaluation of Delamination Propagation in Electronic Packages; 7.5 Summary; References |
| Summary |
In a single and easily accessible source, this comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics. -- Edited summary from book |
| Bibliography |
Includes bibliographical references and index |
| Notes |
Print version record and CIP data provided by publisher |
| Subject |
Microelectronic packaging -- Materials
|
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Adhesives.
|
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Adhesive joints.
|
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adhesive.
|
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TECHNOLOGY & ENGINEERING -- Mechanical.
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Adhesive joints
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Adhesives
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Microelectronic packaging -- Materials
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| Form |
Electronic book
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| Author |
Mittal, K. L., 1945-
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Ahsan, Tanweer
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| LC no. |
2014031115 |
| ISBN |
9781118831342 |
|
1118831349 |
|
9781118831359 |
|
1118831357 |
|
9781118831373 |
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1118831373 |
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1118831330 |
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9781118831335 |
|
