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E-book
Author Liu, Sheng.

Title Modeling and Simulation for Microelectronic Packaging Assembly : Manufacturing, Reliability and Testing
Published Hoboken : John Wiley & Sons, 2011
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Description 1 online resource (1273 pages)
Contents Cover; Title Page; Copyright; Foreword by C.P. Wong; Foreword by Zhigang Suo; Preface; Acknowledgments; About the Authors; Part I: Mechanics and Modeling; Chapter 1: Constitutive Models and Finite Element Method; 1.1 Constitutive Models for Typical Materials; 1.2 Finite Element Method; 1.3 Chapter Summary; References; Chapter 2: Material and Structural Testing for Small Samples; 2.1 Material Testing for Solder Joints; 2.2 Scale Effect of Packaging Materials; 2.3 Two-Ball Joint Specimen Fatigue Testing; 2.4 Chapter Summary; References
4.3 Constitutive Modeling Methodology4.4 Solder Joint Reliability via FEA; 4.5 Life Prediction of Flip-Chip Packages; 4.6 Chapter Summary; References; Chapter 5: Multi-Physics and Multi-Scale Modeling; 5.1 Multi-Physics Modeling; 5.2 Multi-Scale Modeling; 5.3 Chapter Summary; References; Chapter 6: Modeling Validation Tools; 6.1 Structural Mechanics Analysis; 6.2 Requirements of Experimental Methods for Structural Mechanics Analysis; 6.3 Whole Field Optical Techniques; 6.4 Thermal Strains Measurements Using Moiré Interferometry; 6.5 In-Situ Measurements on Micro-Machined Sensors
6.6 Real-Time Measurements Using Speckle Interferometry6.7 Image Processing and Computer Aided Optical Techniques; 6.8 Real-Time Thermal-Mechanical Loading Tools; 6.9 Warpage Measurement Using PM-SM System; 6.10 Chapter Summary; References; Chapter 7: Application of Fracture Mechanics; 7.1 Fundamental of Fracture Mechanics; 7.2 Bulk Material Cracks in Electronic Packages; 7.3 Interfacial Fracture Toughness; 7.4 Three-Dimensional Energy Release Rate Calculation; 7.5 Chapter Summary; References; Chapter 8: Concurrent Engineering for Microelectronics; 8.1 Design Optimization
8.2 New Developments and Trends in Integrated Design Tools8.3 Chapter Summary; References; Part II: Modeling in Microelectronic Packaging and Assembly; Chapter 9: Typical IC Packaging and Assembly Processes; 9.1 Wafer Process and Thinning; 9.2 Die Pick Up; 9.3 Die Attach; 9.4 Wire Bonding; 9.5 Molding; 9.6 Leadframe Forming/Singulation; 9.7 Chapter Summary; References; Chapter 10: Opto Packaging and Assembly; 10.1 Silicon Substrate Based Opto Package Assembly; 10.2 Welding of a Pump Laser Module; 10.3 Chapter Summary; References; Chapter 11: MEMS and MEMS Package Assembly
Chapter 3: Constitutive and User-Supplied Subroutines for Solders Considering Damage Evolution3.1 Constitutive Model for Tin-Lead Solder Joint; 3.2 Visco-Elastic-Plastic Properties and Constitutive Modeling of Underfills; 3.3 A Damage Coupling Framework of Unified Viscoplasticity for the Fatigue of Solder Alloys; 3.4 User-Supplied Subroutines for Solders Considering Damage Evolution; 3.5 Chapter Summary; References; Chapter 4: Accelerated Fatigue Life Assessment Approaches for Solders in Packages; 4.1 Life Prediction Methodology; 4.2 Accelerated Testing Methodology
Summary Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people i
Notes 11.1 A Pressure Sensor Packaging (Deformation and Stress)
Bibliography Includes bibliographical references and index
Notes Print version record
Subject Microelectronic packaging -- Simulation methods.
Form Electronic book
Author Liu, Yong.
ISBN 0470827815 (e-book)
9780470827819 (e-book)