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E-book

Title Lead-free solder interconnect reliability / edited by Dongkai Shangguan
Published Materials Park, OH : ASM International, 2005
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Description 1 online resource (x, 292 pages) : illustrations
Bibliography Includes bibliographical references and index
Notes Print version record
Subject Lead-free electronics manufacturing processes.
Microelectronic packaging -- Reliability.
Solder and soldering.
Form Electronic book
Author Shangguan, Dongkai, 1963-
LC no. 2005050106
ISBN 161503093X (electronic bk.)
9781615030934 (electronic bk.)