| Description |
1 online resource (xxii, 525 pages) : illustrations |
| Contents |
State-of-the-Art of Advanced Packaging -- Chip Partition and Chip Split -- Multiple System and Heterogeneous Integration with TSV Interposers -- Multiple System and Heterogeneous Integration with TSV-Less Interposers -- Chiplets Lateral (Horizontal) Communications -- Cu-Cu Hybrid Bonding |
| Summary |
The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc |
| Bibliography |
Includes bibliographical references (pages 509-517) and index |
| Notes |
Online resource; title from PDF title page (EBSCO, viewed April 7, 2023) |
| Subject |
Integrated circuits -- Design and construction.
|
|
Microelectronic packaging.
|
|
Integrated circuits -- Design and construction
|
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Microelectronic packaging
|
| Form |
Electronic book
|
| ISBN |
9789811999178 |
|
9811999171 |
|
