| Description |
1 online resource (xxxii, 789 pages) : illustrations |
| Series |
IEEE Press series on microelectronic systems |
|
IEEE Press series on microelectronic systems.
|
| Contents |
Introduction and Overview of microelectronics packaging / W.D. Brown -- Microelectronics packaging materials and applications / W.D. Brown -- Electrical design considerations / S.S. Ang -- Modeling and simulation / L.W. Schaper -- Thermal design and management of electronics / R.J. Couvillion -- Mechanical design considerations / W.F. Schmidt -- Packaging trade-offs and decisions / L.W. Schaper -- Computer-aided engineering and design / D.L. Andrews [and others] -- Processing technologies in microelectronic packaging / H.A. Naseem -- Materials and processing considerations / S.S. Ang and W.D. Brown -- Reliability considerations / R.K. Ulrich -- Testing and qualification / S. Kolluru and D. Berleant -- Mainframe packaging: the thermal conduction module (TCM) / T.G. Lenihan -- An industry perspective on MCM-D / J.C. Demmin -- Automotive multichip modules / R.W. Johnson and J.L. Evans -- Analytical techniques for materials characterization / S. Nasrazadani, I. Fritsch, and C.S. Henry -- Cost considerations / E.M. Malstrom -- Advanced topics and future trends in MCM technology / J.E. Brewer, W.D. Brown, and S.S. Ang |
| Summary |
An excellent desk reference for practicing engineers or an ideal text for students in interdisciplinary engineering classes, this comprehensive book discusses all aspects of the sciences and technologies involved in the packaging of integrated circuits, specifically, multichip modules (MCMs). In addition, you will find industrial case studies for several MCM technologies along with an assessment of design trade-offs. Also addressed are the critical role of economics and future trends in electronic packaging |
| Bibliography |
Includes bibliographical references and index |
| Notes |
Print version record |
| Subject |
Microelectronic packaging.
|
|
Multichip modules (Microelectronics) -- Design and construction
|
|
Microelectronic packaging.
|
|
Multichip modules (Microelectronics) -- Design and construction.
|
| Form |
Electronic book
|
| Author |
Brown, William D., 1943-
|
| ISBN |
9780470544082 |
|
0470544082 |
|
