Cover; Guest editorial; Investigation of nano-inks' behaviour on flexible and rigid substrates under various conditions; Mechanical and thermal reliability of conductive circuits inkjet printed on flexible substrates; Drops forming in inkjet printing of flexible electronic circuits; Assessment of stability and reliability of embedded components in printed circuit boards; Effects of varying laser trimming geometries on thin film resistors; RFID monitoring system of fiber optic connectors; Investigations of mutual thermal coupling between SiC Schottky diodes situated in the common case
