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Subjects (1-2 of 2)
Microelectronic packaging -- Materials.
1
E-book
2014

Adhesion in microelectronics



Hoboken, New Jersey : John Wiley and Sons, Inc., [2014]

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2
E-book
2012

LCP for microwave packages and modules



Cambridge ; New York : Cambridge University Press, 2012

Rating:

 
 
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