Limit search to available items
Add Marked to Bag Add All On Page Add Marked to My Lists
Subjects (1-4 of 4)
Microelectronic packaging -- Congresses.
1
E-book
2014

Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31,


International Conference on Packaging and Manufacturing Technology (3rd : 2013 : Brisbane Australia)
[Zurich], Switzerland : Trans Tech Publications, [2014]

Rating:

 
 
2
E-book
2011

Components, packaging and manufacturing technology : selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology (ICCPMT 2010) Sanya, China,


International Conference on Components, Packaging and Manufacturing Technology (2010 : Sanya Shi, China)
Switzerland : Trans Tech Publications, 2011

Rating:

 
 
3
E-book
2017

IMAPS (2016)


Baoyong, Chi


Rating:

 
 
4
E-book
2017

IMAPS Poland 2016


Goosey, Martin


Rating:

 
 
Add Marked to Bag Add All On Page
Locate in results