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Subjects (1-29 of 29)
Microelectronic packaging.
1
E-book
2016

3D IC integration and packaging


Lau, John H., author.
New York : McGraw-Hill Education, [2016]

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4
E-book
2010

Advanced MEMS packaging





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6
E-book
2020

Antenna-in-package technology and applications



Hoboken, New Jersey : Wiley-IEEE Press, [2020]

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7
E-book
2002

Area array packaging handbook


Gilleo, Ken.


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9
E-book
2001

Copper interconnect technology


Steinbruchel, Christoph, author
Bellingham, Washington : SPIE Optical Engineering Press, 2001

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12
E-book
2019

Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition


Tummala, Rao, author
New York, N.Y. : McGraw-Hill Education, [2019]

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13
Book
1997

Fundamentals of microfabrication


Madou, Marc J.
Boca Raton, Fla. : CRC Press, [1997]

Rating:

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Location Call no. Vol. Availability
 W'PONDS  621.38152 Mad/Fom  AVAILABLE
15
E-book
2017

IMAPS (2016)


Baoyong, Chi


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16
E-book
2017

IMAPS Poland 2016


Goosey, Martin


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19
E-book
2013

MEMS : fundamental technology and applications



Boca Raton : CRC Press, [2013]

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20
E-book
2004

MEMS packaging



London : INSPEC, [2004]

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21
22
E-book
2014

Microwave and millimeter-wave electronic packaging


Sturdivant, Rick, author
Boston [Massachusetts] ; London [England] : Artech House, 2014

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23
E-book
2013

Microwave and millimeter-wave electronic packaging


Sturdivant, Rick, author
Norwood : Artech House, 2013

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24
E-book
2007

Physical design essentials : an ASIC design implementation perspective


Golshan, Khosrow.
New York : Springer, [2007]

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26
E-book
2017

RF and microwave microelectronics packaging II



Cham, Switzerland : Springer, 2017

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28
E-book
2008

Three-dimensional integration and modeling : a revolution in RF and wireless packaging


Lee, Jong-Hoon.
[San Rafael, Calif.] : Morgan & Claypool Publishers, [2008]

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29
E-book
2018

Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability



Duxford, United Kingdom : Woodhead Publishing is an imprint of Elsevier, [2018]

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