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Title Lead-free solder interconnect reliability / edited by Dongkai Shangguan
Published Materials Park, OH : ASM International, 2005
Online access available from:
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Description 1 online resource (x, 292 pages) : illustrations
Contents Contents -- Foreword -- Preface -- Lead-Free Soldering and Environmental Compliance: An Overview -- Microstructural Evolution and Interfacial Interactions in Lead-Free Solder Interconnects -- Fatigue and Creep of Lead-Free Solder Alloys: Fundamental Properties -- Lead-Free Solder Joint Reliability Trends -- Chemical Interactions and Reliability Testing for Lead-Free Solder Interconnects -- Tin Whisker Growth on Lead-Free Solder Finishes -- Accelerated Testing Methodology for Lead-Free Solder Interconnects
Thermomechanical Reliability Prediction of Lead-Free Solder InterconnectsDesign for Reliability�Finite Element Modeling of Lead-Free Solder Interconnects -- Characterization and Failure Analyses of Lead-Free Solder Defects -- Reliability of Interconnects with Conductive Adhesives -- Lead-Free Solder Interconnect Reliability Outlook -- Index
Bibliography Includes bibliographical references and index
Notes Print version record
Subject Microelectronic packaging -- Reliability
Solder and soldering.
Lead-free electronics manufacturing processes.
TECHNOLOGY & ENGINEERING -- Electronics -- Digital.
TECHNOLOGY & ENGINEERING -- Electronics -- Microelectronics.
Lead-free electronics manufacturing processes.
Microelectronic packaging -- Reliability.
Solder and soldering.
Genre/Form Electronic book
Form Electronic book
Author Shangguan, Dongkai, 1963-
LC no. 2005050106
ISBN 9781615030934