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Author International Conference on Packaging and Manufacturing Technology (3rd : 2013 : Brisbane Australia)

Title Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia / edited by Andy Wu
Published [Zurich], Switzerland : Trans Tech Publications, [2014]
©2014
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Description 1 online resource (245 pages) : illustrations
Series Applied Mechanics and Materials, 1662-7482 ; Volume 509
Applied mechanics and materials ; v. 509
Contents Components, Packaging and Manufacturing Technology II; Preface and Organizing Committee; Table of Contents; Chapter 1: Materials Science and Materials Processing Technology; Precise Determination of Band Gap Naturally via Absorption/Reflectance/Transmission Spectra; Preparation and Rheological Characterization of Cross-Linked Dialdehyde Carboxymethyl Cellulose; The Curing Behavior of Organosilicone Materials for Large-Power LED Packaging; The Status and Development of ECAP; Chapter 2: Mechanics; Dynamic Torsional Response of a Pile Partially Embedded in Saturated Soil
Development and Manufacture on the New Yoga Exercising DeviceResearch on Compensation Correction of Leak Impact Factor of Kent Index Method; Application of MATLAB in Mechanical Optimal Design; Analysis of Performance of Automotive Exhaust Muffler Based on ANSYS Finite Element; Theoretical Research on a New Type Tube-in-Tube Evaporative Condenser; Study on 3D Modeling and Flow Field Simulation of Urea-SCR Catalytic Converter; Numerical Simulation for Perforation-Caused Leakage Diffusion of Buried Gas Pipeline
Multi-Objective Optimization of Vehicle Air Suspension Based on Simulink-Mfile Mixed ProgrammingImpacts of Solder Voids on Power Devices' Thermal Characteristics; Research on Five-Axis NC Machining Simulation for Four-Blade Propeller Based on UG & VERICUT; Investigation on Aerodynamic Configuration of Monitoring Long Endurance UAV; Passenger Vehicle Clutch Reliability Optimization Based on the Stress-Strength Interference Model; Modularization Technology Development Prospects; Design and Manufacture of a Forehand Attack Exercising Device for Teaching and Training of Table Tennis
Numerical Study on Heat Exchange Characteristics of Runways with Snow-Melting System Using Geothermal SourcesResearch of the Assembly Model Based on Parts Attribute Semantic; Chapter 4: Automation, Control, Information Technology and MEMS; Slant-Face Fiber Side Coupling of Vertical Cavity Surface Emitting Laser; The Relationships of Prior Information and Interval Partition on the Forecasting Effect of Fuzzy Time Series Two-Factor Model; Research on the Behavior of Intelligent Role in Computer Games Based on Behavior Tree; Building the Audit Information System in Cloud Computing Environment
Research on Internal Flow Field Simulation of Hydropower Station Pressure Steel Pipe Based on FLUENTA Discrimination Method of Saturated Sand Liquefaction Possibility Based on Support Vector Machine; Dragon Boat Straight Road Racing Rowing Technique Mechanical Movement Analysis; Dragon Boat Technology on the Influence of Fluid Mechanics Research; Vortex Stability Analysis Based on Coupling the Rubbing with BTA Boring Bar; Development and Application on Ultrahigh Speed Grinding Processing Technology; Chapter 3: Modelling, Design and Manufacturing
Summary Collection of selected, peer reviewed papers from the 2013 3rd International Conference on Components, Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia. The 42 papers are grouped as follows: Chapter 1: Materials Science and Materials Processing Technology; Chapter 2: Mechanics; Chapter 3: Modelling, Design and Manufacturing; Chapter 4: Automation, Control, Information Technology and MEMS
Bibliography Includes bibliographical references and indexes
Notes Online resource; title from PDF title page (ebrary, viewed March 21, 2014)
Subject Electronic apparatus and appliances -- Congresses.
Electronic packaging -- Congresses.
Manufacturing processes -- Congresses.
Microelectronic packaging -- Congresses.
Genre/Form Conference papers and proceedings.
Conference papers and proceedings.
Form Electronic book
Author Wu, Andy, editor
ISBN 303826394X (electronic bk.)
9783038263944 (electronic bk.)