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Microelectronic packaging.
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2016
Lau, John H., author
New York : McGraw-Hill Education, [2016]
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2006
2nd ed. / edited by Richard K. Ulrich, William D. Brown
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2018
Seok, Seonho, author
Cham : Springer International Publishing, [2018]
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2002
Gilleo, Ken.
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2023
Lau, John H., author.
Singapore : Springer, [2023]
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2014
International Conference on Packaging and Manufacturing Technology (3rd : 2013 : Brisbane Australia)
[Zurich], Switzerland : Trans Tech Publications, [2014]
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2011
International Conference on Components, Packaging and Manufacturing Technology (2010 : Sanya Shi, China)
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2001
Steinbruchel, Christoph, author
Bellingham, Washington : SPIE Optical Engineering Press, 2001
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2021
Newark : John Wiley & Sons, Incorporated, 2021
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2005
Schwizer, Jürg.
Rating:
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2019
Tummala, Rao, author
2nd edition
New York, N.Y. : McGraw-Hill Education, [2019]
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1997
Madou, Marc J.
Boca Raton, Fla. : CRC Press, [1997]
Rating:
Request It
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2017
Baoyong, Chi
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2017
Goosey, Martin
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2020
Lall, Pradeep, author
1st edition
Boca Raton : CRC Press, 2020
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2008
Tummala, Rao R., 1942-
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2001
Lau, John H.
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2014
Sturdivant, Rick, author.
Boston [Massachusetts] ; London [England] : Artech House, 2014
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2013
Sturdivant, Rick
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2007
Golshan, Khosrow.
Rating:
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2017
Cham, Switzerland : Springer, 2017
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