Description |
1 online resource (vii, 967 pages) : illustrations |
Contents |
Introduction to microsystems packaging -- Role of packaging in microelectronics -- Role of packaging in microsystems -- Fundamentals of electrical package design -- Fundamentals of design for reliability -- Fundamentals of thermal management -- Fundamentals of single chip packaging -- Fundamentals of multichip packaging -- Fundamentals of IC assembly -- Fundamentals of wafer-level packaging -- Fundamentals of passives: discrete, integrated, and embedded -- Fundamentals of optoelectronics -- Fundamentals of RF packaging -- Fundamentals of microelectromechanical systems -- Fundamentals of sealing and encapsulation -- Fundamentals of system-level PWB technologies -- Fundamentals of board assembly -- Fundamentals of packaging materials and processes -- Fundamentals of electrical testing -- Fundamentals of packaging manufacturing -- Fundamentals of microsystems design for environment -- Fundamentals of microsystems reliability |
Summary |
"A rigorous and thorough introduction to electronic packaging technologies. Each chapter covers a single major packaging technology illustrated with schematics and diagrams. Aspects of electrical, mechanical, chemical, and materials packaging are identified in each chapter." |
Notes |
Includes glossary |
Bibliography |
Includes bibliographical references and index |
Notes |
Print version record |
Subject |
Electronic packaging -- Handbooks, manuals, etc
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Microelectronic packaging -- Handbooks, manuals, etc
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Miniature electronic equipment -- Packaging -- Handbooks, manuals, etc
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TECHNOLOGY & ENGINEERING -- Electronics -- Microelectronics.
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TECHNOLOGY & ENGINEERING -- Electronics -- Digital.
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Electronic packaging.
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Microelectronic packaging.
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Genre/Form |
Internet resources
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Handbooks and manuals.
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Handbooks and manuals.
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Form |
Electronic book
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Author |
Tummala, Rao R., 1942-
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ISBN |
9780071418072 |
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9780071450034 |
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0071450033 |
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9780071371698 |
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0071418075 |
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0071371699 |
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