| Description |
1 online resource (x, 304 pages) : illustrations |
| Series |
Structural integrity, 2522-5618 ; v. 10 |
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Structural integrity (Series) ; v. 10.
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| Contents |
Intro; Preface; Contents; 1 Heat Conduction and Moisture Diffusion Theories; 1.1 Introduction; 1.2 Heat Conduction; 1.2.1 Fourier Heat Conduction; 1.2.1.1 Thermal Boundary Conditions; 1.2.1.2 Thermal Initial Conditions; 1.2.1.3 Thermal Interfacial Conditions; 1.2.2 Non-Fourier Heat Conduction; 1.2.2.1 Cattaneo-Vernotte Heat Conduction; 1.2.2.2 Dual-Phase-Lag Heat Conduction; 1.2.2.3 Three-Phase-Lag Heat Conduction; 1.2.2.4 Fractional Phase-Lag Heat Conduction; 1.2.2.5 Nonlocal Phase-Lag Heat Conduction; 1.3 Moisture Diffusion; 1.3.1 Fickian Moisture Diffusion |
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1.3.2 Non-Fickian Moisture DiffusionReferences; 2 Basic Problems of Non-Fourier Heat Conduction; 2.1 Introduction; 2.2 Laplace Transform and Laplace Inversion; 2.2.1 Fast Laplace Inverse Transform; 2.2.2 Reimann Sum Approximation; 2.2.3 Laplace Inversion by Jacobi Polynomial; 2.3 Non-Fourier Heat Conduction in a Semi-infinite Strip; 2.4 Nonlocal Phase-Lag Heat Conduction in a Finite Strip; 2.4.1 Molecular Dynamics to Determine Correlating Nonlocal Length; 2.4.1.1 Nonlocal Heat Conduction in Functionally Graded Materials; 2.5 Three-Phase-Lag Heat Conduction in 1D Strips, Cylinders, and Spheres |
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2.5.1 Effect of Bonding Imperfection on Thermal Wave Propagation2.5.2 Effect of Material Heterogeneity on Thermal Wave Propagation; 2.5.3 Thermal Response of a Lightweight Sandwich Circular Panel with a Porous Core; 2.6 Dual-Phase-Lag Heat Conduction in Multi-dimensional Media; 2.6.1 DPL Heat Conduction in Multi-dimensional Cylindrical Panels; 2.6.2 DPL Heat Conduction in Multi-dimensional Spherical Vessels; References; 3 Multiphysics of Smart Materials and Structures; 3.1 Smart Materials; 3.1.1 Piezoelectric Materials; 3.1.1.1 Potential Field Equations; 3.1.2 Magnetoelectroelastic Materials |
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3.1.2.1 Potential Field Equations3.1.2.2 Conservation Equations; 3.1.2.3 Fourier Heat Conduction and Fickian Moisture Diffusion; 3.1.3 Advanced Smart Materials; 3.2 Thermal Stress Analysis in Homogenous Smart Materials; 3.2.1 Solution for the a Thermomagnetoelastic FGM Cylinder; 3.2.2 Solution for Thermo-Magnetoelectroelastic Homogeneous Cylinder; 3.2.3 Benchmark Results; 3.3 Thermal Stress Analysis of Heterogeneous Smart Materials; 3.3.1 Solution Procedures; 3.3.2 Benchmark Results; 3.4 Effect of Hygrothermal Excitation on One-Dimensional Smart Structures; 3.4.1 Solution Procedure |
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3.4.2 MEE Hollow Cylinder3.4.3 MEE Solid Cylinder; 3.4.4 Benchmark Results; 3.5 Remarks; References; 4 Coupled Thermal Stresses in Advanced Smart Materials; 4.1 Functionally Graded Materials; 4.2 Hyperbolic Coupled Thermopiezoelectricity in One-Dimensional Rod; 4.2.1 Introduction; 4.2.2 Homogeneous Rod Problem; 4.2.2.1 Fundamental and Governing Equations; 4.2.3 Solution Procedure; 4.2.3.1 Solution in Laplace Domain; 4.2.3.2 Numerical Inversion of Laplace Transform; 4.2.4 Results and Discussion; 4.3 Hyperbolic Coupled Thermopiezoelectricity in Cylindrical Smart Materials; 4.3.1 Introduction |
| Summary |
This is the first single volume monograph that systematically summarizes the recent progress in using non-Fourier heat conduction theories to deal with the multiphysical behaviour of smart materials and structures. The book contains six chapters and starts with a brief introduction to Fourier and non-Fourier heat conduction theories. Non-Fourier heat conduction theories include Cattaneo-Vernotte, dual-phase-lag (DPL), three-phase-lag (TPL), fractional phase-lag, and nonlocal phase-lag heat theories. Then, the fundamentals of thermal wave characteristics are introduced through reviewing the methods for solving non-Fourier heat conduction theories and by presenting transient heat transport in representative homogeneous and advanced heterogeneous materials. The book provides the fundamentals of smart materials and structures, including the background, application, and governing equations. In particular, functionally-graded smart structures made of piezoelectric, piezomagnetic, and magnetoelectroelastic materials are introduced as they represent the recent development in the industry. A series of uncoupled thermal stress analyses on one-dimensional structures are also included. The volume ends with coupled thermal stress analyses of one-dimensional homogenous and heterogeneous smart piezoelectric structures considering different coupled thermopiezoelectric theories. Last but not least, fracture behavior of smart structures under thermal disturbance is investigated and the authors propose directions for future research on the topic of multiphysical analysis of smart materials |
| Bibliography |
Includes bibliographical references |
| Notes |
4.3.2 Hollow Cylinder Problem |
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Print version record |
| Subject |
Smart materials.
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Smart structures.
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Thermal stresses.
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Materials -- Thermal conductivity
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thermal stress.
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Smart materials
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Smart structures
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Thermal stresses
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| Form |
Electronic book
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| Author |
Akbarzadeh, Abdolhamid
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| ISBN |
9783030252014 |
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3030252019 |
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