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Subjects (1-3 of 3)
Electronic packaging -- Materials -- Congresses
1
E-book
2018

Electronic packaging interconnect technology : Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : selected, peer reviewed papers from the Electronic Packaging Interconnect Technolog


Electronic Packaging Interconnect Technology Symposium (2017 : Fukuoka)

Zurich : Trans Tech Publications Ltd, [2018]

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Electronic Resources
2
Book
1992

Electronic packaging : materials and processes to reduce package cycle time and improve reliability : proceedings of the 7th Electronic Materials and Processing Congress, 24-27 August 1992, Cambridge,


Electronic Materials and Processing Congress (7th : 1992 : Cambridge, Mass.)

Materials Park, OH : ASM International, [1992]

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Location Call no. Vol. Availability
 W'PONDS  621.381046 Ele/Epm 1992  AVAILABLE
3
E-journal
 

Proceedings


International Advanced Packaging Materials Symposium

Piscataway, NJ : IEEE Service Center

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