| Description |
1 online resource |
| Contents |
Front Matter -- Colour Plates -- Section I: Low-. Low- Materials: Recent Advances / Geraud Dubois, Willi Volksen -- Ultra-Low- by CVD: Deposition and Curing / Vincent Jousseaume, Aziz Zenasni, Olivier Gourhant, Laurent Favennec, Mikhail R Baklanov -- Plasma Processing of Low- Dielectrics / Hualiang Shi, Denis Shamiryan, Jean-Fraṅois de Marneffe, Huai Huang, Paul S Ho, Mikhail R Baklanov -- Wet Clean Applications in Porous Low- Patterning Processes / Quoc Toan Le, Guy Vereecke, Herbert Struyf, Els Kesters, Mikhail R Baklanov -- Section II: Conductive Layers and Barriers. Copper Electroplating for On-Chip Metallization / Valery M Dubin -- Diffusion Barriers / Michael Hecker, Rene Hubner -- Section III: Integration and Reliability. Process Integration of Interconnects / Sridhar Balakrishnan, Ruth Brain, Larry Zhao -- Chemical Mechanical Planarization for Cu₆Low- Integration / Gautam Banerjee -- Scaling and Microstructure Effects on Electromigration Reliability for Cu Interconnects / Chao-Kun Hu, Rene Hubner, Lijuan Zhang, Meike Hauschildt, Paul S Ho -- Mechanical Reliability of Low- Dielectrics / Kris Vanstreels, Han Li, Joost J Vlassak -- Electrical Breakdown in Advanced Interconnect Dielectrics / Ennis T Ogawa, Oliver Aubel -- Section IV: New Approaches. 3D Interconnect Technology / John U Knickerbocker, Lay Wai Kong, Sven Niese, Alain Diebold, Ehrenfried Zschech -- Carbon Nanotubes for Interconnects / Mizuhisa Nihei, Motonobu Sato, Akio Kawabata, Shintaro Sato, Yuji Awano -- Optical Interconnects / Wim Bogaerts -- Wireless Interchip Interconnects / Takamaro Kikkawa -- Index |
| Summary |
"This book presents an in-depth overview of present status, novel developments and new materials and approaches for advanced interconnect technology"-- Provided by publisher |
| Bibliography |
Includes bibliographical references and index |
| Notes |
Print version record |
| In |
EBL |
| Subject |
Interconnects (Integrated circuit technology)
|
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Integrated circuits -- Ultra large scale integration.
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TECHNOLOGY & ENGINEERING -- Electronics -- Circuits -- VLSI & ULSI.
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COMPUTERS -- Logic Design.
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TECHNOLOGY & ENGINEERING -- Electronics -- Circuits -- Logic.
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Integrated circuits -- Ultra large scale integration
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Interconnects (Integrated circuit technology)
|
| Form |
Electronic book
|
| Author |
Baklanov, Mikhail
|
|
Ho, P. S
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Zschech, Ehrenfried
|
| ISBN |
9781119963240 |
|
1119963249 |
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9781119963677 |
|
1119963672 |
|
1280590807 |
|
9781280590801 |
|
