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Title Fundamentals of lead-free solder interconnect technology : from microstructures to reliability / Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma
Published New York : Springer, [2014]
Online access available from:
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Description 1 online resource
Contents Introduction -- Interconnection : The Joint -- Phase Equilibria and Microstructure of Sn-Ag-Cu Alloys -- Microstructure Development; Solidification and Isothermal Aging -- Thermal Cycling Performance -- Mechanical Stability and Performance -- Chemical and Environment Attack -- Challenges in Future Generation Interconnects: Microstructure Again
Summary This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution. The continuing miniaturization of electronic systems will increase the demand on the performance of solder joints, which will require new alloy and processing strategies as well as interconnection design strategies. This book provides a foundation on which improved performance and new design approaches can be based. In summary, this book: Provides an up-to-date overview on lead-free soldering technologies Covers the fundamentals, implementation, reliability, challenges and risks of lead-free soldering technique Explores emerging technologies in lead-free soldering
Analysis engineering
optische instrumenten
optical instruments
Engineering (General)
Techniek (algemeen)
Bibliography Includes bibliographical references and index
Notes Online resource; title from PDF title page (SpringerLink, viewed November 13, 2014)
Subject Lead-free electronics manufacturing processes.
Solder and soldering.
Electronic devices & materials.
Circuits & components.
Electronics engineering.
Technology & Engineering -- Material Science.
Technology & Engineering -- Electronics -- Circuits -- General.
Technology & Engineering -- Electronics -- General.
Lead-free electronics manufacturing processes.
Solder and soldering.
Genre/Form Electronic books
Form Electronic book
Author Lee, Tae-Kyu, author
Bieler, Thomas R., author
Kim, Choong-Un, author
Ma, Hongtao, author
ISBN 9781461492665