| Description |
1 online resource |
| Series |
Series on integrated circuits and systems |
|
Series on integrated circuits and systems.
|
| Contents |
Overview of wafer-level 3D ICs / Chuan Seng Tan, Ronald J. Gutmann, and L. Rafael Reif -- Monolithic 3D integrated circuits / Christopher Petti, S. Brad Herner and Andrew Walker -- Stacked CMOS technologies / Mansun Chan -- Wafer-bonding technologies and strategies for 3D ICs / Shari Farrens -- Through-silicon via fabrication, backgrind, and handle wafer technologies / Sharath Hosali [and others] -- Cu wafer bonding for 3D IC applications / Kuan-Neng Chen [and others] -- Cu/Sn solid-liquid interdiffusion bonding / A. Munding [and others] -- An SOI-based 3D circuit integration technology / James Burns [and others] -- 3D fabrication options for high-performance CMOS technology / Anna W. Topol [and others] -- 3D integration based upon dielectric adhesive bonding / Jian-Qiang Lu, Timothy S. Cale, and Ronald J. Gutmann -- Direct hybrid bonding / Bart Swinnen [and others] -- 3D memory / Robert S. Patti -- Circuit architectures for 3D integration / Nisha Checka -- Thermal challenges of 3D ICs / Sheng-Chih Lin and Kaustav Banerjee -- Status and outlook / Scott K. Pozder and Robert E. Jones |
| Summary |
Annotation This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry |
| Bibliography |
Includes bibliographical references and index |
| Notes |
Print version record |
| Subject |
Integrated circuits -- Wafer-scale integration.
|
|
TECHNOLOGY & ENGINEERING -- Electronics -- Circuits -- Integrated.
|
|
TECHNOLOGY & ENGINEERING -- Electronics -- Circuits -- General.
|
|
Ingénierie.
|
|
Integrated circuits -- Wafer-scale integration.
|
| Form |
Electronic book
|
| Author |
Tan, Chuan Seng.
|
|
Gutmann, Ronald J.
|
|
Reif, Rafael.
|
| ISBN |
9780387765341 |
|
0387765344 |
|
