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Subjects (1-5 of 5)
Integrated circuits -- Wafer-scale integration.
1 2019 Advances in Embedded and Fan-Out Wafer Level Packaging Technologies Keser, Beth, author 1st edition Wiley-IEEE Press, 2019 Rating: Electronic Resources
2 2019 Advances in embedded and fan-out wafer level packaging technologies Hoboken, NJ, USA : John Wiley & Sons, Inc., 2019 Rating: Electronic Resources
3 IC layout basics : a practical guide Saint, Christopher, 1961- Rating:
4 2011 Ultra-thin chip technology and applications Rating: Electronic Resources
5 2008 Wafer level 3-D ICs process technology Rating: Electronic Resources
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Advances in Embedded and Fan-Out Wafer Level Packaging Technologies