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Title Advanced flip chip packaging / edited by Ho-Ming Tong, Yi-Shao Lai, C.P. Wong
Published New York ; London : Springer, 2013

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Description 1 online resource
Contents Market Trends: Past, Present, and Future / Robert Lanzone -- Technology Trends: Past, Present, and Future / Eric Perfecto, Kamalesh Srivastava -- Bumping Technologies / Michael Töpper, Daniel Lu -- Flip-Chip Interconnections: Past, Present, and Future / Sung-Kwon Kang, Da-Yuan Shih, William E. Bernier -- Flip Chip Underfill: Materials, Process, and Reliability / Zhuqing Zhang, Shijian Luo, C.P. Wong -- Conductive Adhesives for Flip-Chip Applications / Daoqiang Daniel Lu, C.P. Wong -- Substrate Technology / Yutaka Tsukada -- IC-Package-System Integration Design / Yiyu Shi, Yang Shang, Hao Yu, Shauki Elassaad -- Thermal Management of Flip Chip Packages / Richard C. Chu, Robert E. Simons, Madhusudan Iyengar -- Thermo-mechanical Reliability in Flip-Chip Packages / Li Li, Hongtao Ma -- Interfacial Reactions and Electromigration in Flip-Chip Solder Joints / C.E. Ho, C.R. Kao, K.N. Tu
Summary Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable. This book also: Offers broad-ranging chapters with a focus on IC-package-system integration. Provides viewpoints from leading industry executives and experts. Details state-of-the-art achievements in process technologies and scientific research. Presents a clear development history and touches on trends in the industry while also discussing up-to-date technology information. Advanced Flip Chip Packaging is an ideal book for engineers, researchers, and graduate students interested in the field of flip chip packaging
Bibliography Includes bibliographical references
Notes Print version record
Subject Flip chip technology.
Electronic packaging.
TECHNOLOGY & ENGINEERING -- Electronics -- Digital.
TECHNOLOGY & ENGINEERING -- Electronics -- Microelectronics.
Ingénierie.
Electronic packaging.
Flip chip technology.
Genre/Form Electronic books
Form Electronic book
Author Tong, Ho-ming Herbert, 1954-
Lai, Yi-Shao.
Wong, C. P., 1947-
ISBN 9781441957689
1441957685