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Subjects (1-37 of 37)
Electronic packaging.
1 2006 Advanced electronic packaging 2nd ed. / edited by Richard K. Ulrich, William D. Brown Rating: Electronic Resources
2 2013 Advanced flip chip packaging Rating: Electronic Resources More...
3 2006 Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging Rating: Electronic Resources
4 2007 ASIC design in the silicon sandbox : a complete guide to building mixed signal integrated circuits Barr, Keith Rating: Electronic Resources
5 2018 ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems : August 27-30, 2018, San Francisco, California, USA ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2018 : San Francisco, Calif.), creator. New York, N.Y. : American Society of Mechanical Engineers, 2018 Rating:
6 2014 Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, International Conference on Packaging and Manufacturing Technology (3rd : 2013 : Brisbane Australia) [Zurich], Switzerland : Trans Tech Publications, [2014] Rating: Electronic Resources More...
7 2011 Components, packaging and manufacturing technology : selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology, Sanya, China, December 9-10 International Conference on Components, Packaging and Manufacturing Technology (2010 : Sanya Shi, China) Rating: Electronic Resources
8 2001 Copper interconnect technology Steinbruchel, Christoph, author Bellingham, Washington : SPIE Optical Engineering Press, 2001 Rating: Electronic Resources
9 2009 Electrical conductive adhesives with nanotechnologies Li, Yi (Grace Yi) Rating: Electronic Resources More...
10 2019 Electronic enclosures, housings and packages Süli, Frank, author Duxford, United Kingdom : Woodhead Publishing, [2019] Rating: Electronic Resources
11 2018 Electronic packaging interconnect technology : Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : selected, peer reviewed papers from the Electronic Packaging Interconnect Technolog Electronic Packaging Interconnect Technology Symposium (2017 : Fukuoka) Zurich : Trans Tech Publications Ltd, [2018] Rating: Electronic Resources
12 2022 Electronic packaging science and technology Tu, K. N. (King-Ning), 1937- author. Hoboken, NJ : John Wiley & Sons, Inc., 2022 Rating: Electronic Resources
13 2020 Electronic Scanned Array Design Williams, John S. author Stevenage The Institution of Engineering and Technology 2020 Rating: Electronic Resources
14 1999 Embedded Systems Design with 8051 Microcontrollers : Hardware and Software First edition Boca Raton, FL : CRC Press, 1999 Rating: Electronic Resources
15 2013 Encyclopedia of thermal packaging. Rating: Electronic Resources
16 2013 Encyclopedia of thermal packaging. Rating: Electronic Resources
17 2014 Encyclopedia of thermal packaging. New Jersey : World Scientific, 2014 Rating: Electronic Resources
18 2014 Food Factory: Series 1 - Ep 14 Australia : Discovery Science, 2014 Rating:
19 2014 Food Factory: Series 1 - Ep 17 Australia : Discovery Science, 2014 Rating:
20 2001 Fundamentals of microsystems packaging Rating: Electronic Resources
21 2010 Heat transfer : thermal management of electronics Shabany, Younes Rating: Electronic Resources
22 2012 Hermeticity of electronic packages Greenhouse, Hal. 2nd ed Rating: Electronic Resources
23 2000 Hermeticity of electronic packages Greenhouse, Hal. Rating: Electronic Resources
24 2019 Lead-free soldering process development and reliability BATH Rating: Electronic Resources
25 2011 LED packaging for lighting applications : design, manufacturing, and testing Liu, S. (Sheng), 1963- Rating: Electronic Resources
26 2005 Microscale heat transfer : fundamentals and applications NATO Advanced Study Institute on Microscale Heat Transfer - Fundamentals and Applications in Biological and Microelectromechanical Systems (2004 : Cesme-Izmir, Turkey) Rating: Electronic Resources More...
27 2017 Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging Wei, Xing-Chang, author. Boca Raton : CRC Press, Taylor & Francis Group, [2017] Rating: Electronic Resources
28 2010 Nano-bio-electronic, photonic and MEMS packaging Rating: Electronic Resources More...
29 2021 Nano-bio-electronic, photonic and MEMS packaging 2nd edition Cham : Springer, 2021 Rating: Electronic Resources More...
30 2008 Nanopackaging : nanotechnologies and electronics packaging Rating: Electronic Resources More...
31 1990 Newnes electronics assembly handbook Brindley, Keith Oxford : Heinemann Newnes, 1990 Rating: Electronic Resources
32 2022 Open circuits : the inner beauty of electronic components Oskay, Windell, author. San Francisco, CA : No Starch Press, Inc., [2022] Rating: Electronic Resources
33 2012 Power electronic packaging : design, assembly process, reliability and modeling Liu, Yong Rating: Electronic Resources More...
34 2010 Proceedings of the ASME InterPack Conference--2009 : presented at 2009 ASME InterPack Conference : July 19-23, 2009, San Francisco, California, USA ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems (2009 : San Francisco, Calif.) Rating:
35 2023 Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium : EPITS 2022, 14-15 September, Langkawi, Malaysia Electronic Packaging Interconnect Technology Symposium (2022 : Kuah, Kedah, Malaysia) Singapore : Springer, 2023 Rating: Electronic Resources
36 2002 Reflow soldering processes : SMT, BGA, CSP and flip chip technologies Lee, Ning-Cheng. Rating: Electronic Resources More...
37 2009 RF and microwave microelectronics packaging Rating: Electronic Resources More...
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