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Title Moisture sensitivity of plastic packages of IC devices / X.J. Fan, E. Suhir, editors ; foreword by C.P. Wong
Published New York : Springer, [2010]
Online access available from:
Springer eBooks    View Resource Record  


Description 1 online resource (xvii, 570 pages) : illustrations
Series Micro- and opto-electronic materials, structures, and systems
Micro- and opto-electronic materials, structures, and systems.
Contents Microelectronics and microsystems packaging technology -- Packaging reliability -- Moisture related reliability test and specifications -- Moisture absorption, desorption and transport -- Characterization of moisture behaviors -- Hygroscopic swelling characterization -- Vapor pressure evolution -- Hygro-thermal mechanics -- Caviation instability -- Effect of moisture on material properties -- Electrochemical metal migration and corrosion -- Methodology for accelerated moisture sensitivity test -- Applications
Bibliography Includes bibliographical references and index
Notes Print version record
Subject Electronic packaging -- Moisture.
Plastics in packaging -- Moisture.
Form Electronic book
Author Fan, X. J.
Suhir, Ephraim.
LC no. 2010927324
ISBN 1441957189
1441957197 (electronic bk.)
9781441957191 (electronic bk.)