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Book Cover
Author Harman, George G.

Title Wire bonding in microelectronics / George Harman
Edition 3rd ed
Published New York : McGraw-Hill, ©2010
Online access available from:
AccessEngineering    View Resource Record  


Description 1 online resource (xx, 426 pages) : illustrations
Series McGraw-Hill's AccessEngineering
Contents Introduction to Third Edition; Acknowledgments; Introduction to CD; 1 The Technical Introduction to the Third Edition; 1.1 The Wedge- and Ball-Bonding Machine Operations; 1.2 How to Approach Bonding Problems?; 1.2.1 Which Metals Can Be Ultrasonically Bonded?; 1.2.2 Assessing the Bondability and Reliability of Proposed New Bond Systems; 1.2.3 Some Unusual Uses of Wire Bonds; References; 2 Ultrasonic Bonding Systems and Technologies, Including a Description of the Ultrasonic Wire Bonding Mechanism; 2.1 Introduction; 2.2 Ultrasonic Transducer and Tool Vibration Modes
2.3 How Ultrasonic Bonds Are Made (Empirical Description)2.3.1. Brief Phenomenological Explanation of the Ultrasonic and Thermosonic Bonding Process; 2.4 Bonding with High(er) Frequency Ultrasonic Energy; 2.5 In-Process (Real-Time) Bond Monitoring; 2.6 Wire-Bonding Technologies; 2.6.1 Thermocompression Bonding; 2.6.2 Ultrasonic Wedge Bonding (Small- and Large-Diameter Wires); 2.6.3 Thermosonic Ball and Wedge Bonding; 2.6.4 Choosing a New/Different Wire-Bonding Technology; 2.7 Variations of Fine-Wire Bonding Technology; 2.7.1 Ribbon Wire Bonding; 2.7.2 Parallel Gap and Tweezer Welding
2.8 Major Chip Interconnection Alternatives to Wire Bonding (Flip Chip and TAB)2.8.1 Flip Chip; 2.8.2 Tape-Automated Bonding; 2.9 Wire-Bonding Technology: A Comparison and Future Directions; References; 3 Bonding Wire Metallurgy and Characteristics That Can Affect Bonding, Reliability, or Testing; 3.1 Introduction; 3.2 Stress-Strain Characteristics of Bonding Wires; 3.3 The Shelf-Life Aging of Bonding Wires; 3.4 General Discussion of Gold Bonding Wire; 3.5 Aluminum Wire for Ultrasonic Wedge Bonding; 3.6 Wire and Metallization Hardness
3.7 The Effect of EFO Polarity on Gold Wire and Its Metallurgy3.8 Metallurgical Fatigue of Bonding Wires; 3.9 Copper Wire for Ball Bonding; 3.10 Conductor Burn Out (Fusing); 3.10.1 Bonding Wires; 3.10.2 The Maximum Allowable Current for PCB and MCM Conductors; Appendix 3A; Appendix 3B; Conclusion; References; 4 Wire Bond Testing; 4.1 Introduction; 4.2 The Destructive Bond Pull Test; 4.2.1 Variables of the Bond Pull Test; 4.2.2 Peeling (Tweezer Pulling) for "Quality Tests" and Troubleshooting of Wedge Bonds and Crescent (Tail) Bonds
4.2.3 Failure Predictions That Are Based on Pull Test Data Must Have Confirmed Normality4.2.4 Effect of Metallurgy and Bonding Processes on the Bond Pull Force; 4.2.5 Effect of Wire Elongation on Bond Pull Force (Primarily for Large-Diameter Al, but also for Au Wire Used in Ball Bonding)[4-9]; 4.3 Ball-Bond Shear Test; 4.3.1 Introduction; 4.3.2 Apparatus; 4.3.3 A Manual Shear Probe As an Aid in Setting Up Ball Bonder (For Laboratory Use); 4.3.4 Interferences to Making Accurate Ball-Shear Test Measurements; 4.3.5 Ball-Shear Force versus Bonded Area
Summary Presenting a definitive resource on the critical process of connecting semiconductors with their packages; this authoritative guide covers every aspect of designing; manufacturing; and evaluating wire bonds engineered with cutting-edge techniques. -- Edited summary from book
Bibliography Includes bibliographical references and index
Notes Print version record
Subject Electronic packaging -- Defects
Electronic packaging -- Reliability
Semiconductors -- Failures.
Ultrasonic welding.
Wire bonding (Electronic packaging) -- Production control
Electronic packaging -- Defects.
Electronic packaging -- Reliability.
Semiconductors -- Failures.
TECHNOLOGY & ENGINEERING -- Electronics -- Digital.
TECHNOLOGY & ENGINEERING -- Electronics -- Microelectronics.
Ultrasonic welding.
Wire bonding (Electronic packaging) -- Production control.
Genre/Form Electronic books.
Internet resources.
Form Electronic book
ISBN 007164265X