Title ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems : August 29-September 1, 2017, San Francisco, California, USA

Published New York, N.Y. : American Society of Mechanical Engineers, 2017

Online access available from: ASME    View Resource Record

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Description 1 online resource (1 volume) : illustrations Contents Heterogeneous integration: micro-systems with diverse functionality -- Servers of the future -- Structural and physical health monitoring -- Energy conversion and storage -- Transportation: autonomous and electric vehicles Bibliography Includes bibliographical references Notes Online resource; title from ASME digital collection page (viewed October 27, 2017) Subject Electronic packaging -- Congresses. Genre/Form Conference papers and proceedings. Conference papers and proceedings. Form Electronic book Author American Society of Mechanical Engineers, publisher ASME Conference on Information Storage and Processing Systems (2017 : San Francisco, California), contributor ISBN (print)

Other Titles Title at top of each PDF article: Proceedings of the ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK2017, August 29-September 1, 2017, San Francisco, California, USA Title from ASME website: ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems (InterPACK2017) InterPACK2017

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