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E-book
Author ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2015 : San Francisco, Calif.), creator

Title ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems : collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels : July 6-9, 2015, San Francisco, California, USA
Published New York, N.Y. : American Society of Mechanical Engineers, 2015
Online access available from:
ASME : Volume 1    View Resource Record  

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Description 1 online resource (3 volumes) : illustrations
Contents Volume 1: Thermal management -- Volume 2: Advanced electronics and photonics: Packaging materials and processing ; Advanced electronics and photonics: Packaging, interconnect and reliability ; Fundamentals of thermal and fluid transport in nano, micro, and mini scales -- Volume 3: Advanced fabrication and manufacturing ; Emerging technology frontiers ; Energy, health, and water-applications of nano-, micro- and mini-scale devices ; MEMS and NEMS ; Technology update talks ; Thermal management using micro channels, jets, sprays
Bibliography Includes bibliographical references
Subject Electronic packaging -- Congresses.
Genre/Form Conference papers and proceedings.
Conference papers and proceedings.
Form Electronic book
Author American Society of Mechanical Engineers, publisher
International Conference on Nanochannels, Microchannels and Minichannels (13th : 2015 : San Francisco, California), contributor
ISBN (volume 1 ;) (print)
(volume 2 ;) (print)
(volume 3 ;) (print)
Other Titles Title at top of each PDF article: Proceedings of the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK2015, July 6-9, 2015, San Francisco, California, USA
Title from ASME website: ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels (InterPACK2015)
InterPACK2015