Other Titles |
Title at top of each PDF article: Proceedings of the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK2015, July 6-9, 2015, San Francisco, California, USA |
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Title from ASME website: ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels (InterPACK2015) |
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InterPACK2015 |
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