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Book Cover
E-journal
Author International Microsystems, Packaging, Assembly, and Circuits Technology Conference

Title Proceedings of technical papers
Published Piscataway, NJ : Institute of Electrical and Electronics Engineers
Began with 2007
Online access available from:
IEEE Xplore    01 Jan. 2006-
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Description Online resource
Notes Published by Institute of Electrical and Electronics Engineers in association with individual conference organizations
Description based on print version record
Subject Microelectronic packaging -- Congresses
Electronic packaging -- Congresses
Microelectronics -- Congresses
Form Electronic journal
Author Institute of Electrical and Electronics Engineers
LC no. 2009204101
ISSN 2150-5942
2150-5934
ABBREV TI Proc. tech. pap. (Int. Microsyst. Packag. Assem. Circuits Technol. Conf., Online)
OTHER TI Proceedings of technical papers (International Microsystems, Packaging, Assembly, and Circuits Technology Conference. Online)
Other Titles In IEEE Xplore: Microsystems, Packaging, Assembly and Circuits Technology (IMPACT), International
International Microsystems, Packaging, Assembly, and Circuits Technology Conference
IMPACT