| Description |
1 online resource |
| Series |
Quality and Reliability Engineering Ser |
|
Quality and Reliability Engineering Ser
|
| Contents |
Cover -- Title Page -- Copyright -- Contents -- List of Contributors -- Introduction -- Chapter 1 Lead-Free Surface Mount Technology -- 1.1 Introduction -- 1.2 Lead-Free Solder Paste Alloys -- 1.3 Solder Paste Printing -- 1.3.1 Introduction -- 1.3.2 Key Paste Printing Elements -- 1.4 Component Placement -- 1.4.1 Introduction -- 1.4.2 Key Placement Parameters -- 1.4.2.1 Nozzle -- 1.4.2.2 Vision System -- 1.4.2.3 PCB Support -- 1.4.2.4 Component Size, Packaging, and Feeder Capacity -- 1.4.2.5 Feeder Capacity -- 1.5 Reflow Process -- 1.5.1 Introduction -- 1.5.2 Key Parameters -- 1.5.2.1 Preheat |
|
1.5.2.2 Soak -- 1.5.2.3 Reflow -- 1.5.2.4 Cooling -- 1.5.2.5 Reflow Atmosphere -- 1.6 Vacuum Soldering -- 1.7 Paste in Hole -- 1.8 Robotic Soldering -- 1.9 Advanced Technologies -- 1.9.1 Flip Chip -- 1.9.2 Package on Package -- 1.10 Inspection -- 1.10.1 Solder Paste Inspection (SPI) -- 1.10.2 Solder Joint Inspection -- 1.10.2.1 Automated Optical Inspection (AOI) -- 1.10.2.2 X-ray Inspection -- 1.11 Conclusions -- References -- Chapter 2 Wave/Selective Soldering -- 2.1 Introduction -- 2.2 Flux -- 2.2.1 The Function of a Flux -- 2.2.2 Flux Contents -- 2.3 Amount of Flux Application on a Board |
|
2.4 Flux Handling -- 2.5 Flux Application -- 2.5.1 Methods to Apply Flux (Wave Soldering) -- 2.5.2 Methods to Apply Flux (Selective Soldering) -- 2.6 Preheat -- 2.6.1 Preheat Process-Heating Methods -- 2.6.2 Preheat Temperatures -- 2.6.3 Preheat Time -- 2.6.4 Controlling Preheat Temperatures -- 2.6.5 Board Warpage Compensation (Selective Soldering) -- 2.7 Selective Soldering -- 2.7.1 Different Selective Soldering Point to Point Nozzles (Selective Soldering) -- 2.7.2 Solder Temperatures (Selective Soldering) -- 2.7.3 Dip/Contact Times (Selective Soldering) |
|
2.7.4 Drag Conditions (Selective Soldering) -- 2.7.5 Nitrogen Environment (Selective Soldering) -- 2.7.6 Wave Height Controls (Selective Soldering) -- 2.7.7 De-Bridging Tools (Selective Soldering) -- 2.7.8 Solder Pot (Selective Soldering) -- 2.7.9 Topside Heating during Soldering (Selective Soldering) -- 2.7.10 Selective Soldering Dip Process with Nozzle Plates (Selective Soldering) -- 2.7.11 Solder Temperatures for Multi-Wave Dip Soldering (Selective Soldering) -- 2.7.12 Nitrogen Environment (Selective Soldering) -- 2.7.13 Wave Height Control (Selective Soldering) |
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2.7.14 Dip Time - Contact Time with Solder (Selective Soldering) -- 2.7.15 Solder Flow Acceleration and Deceleration (Selective Soldering) -- 2.7.16 De-Bridging Tools (Selective Soldering) -- 2.7.17 Pallets (Selective Soldering) -- 2.7.18 Conveyor (Selective Soldering) -- 2.8 Wave Soldering -- 2.8.1 Wave Formers (Wave Soldering) -- 2.8.2 Pallets (Wave Soldering) -- 2.8.3 Nitrogen Environment (Wave Soldering) -- 2.8.4 Process Control (Wave Soldering) -- 2.8.5 Conveyor (Wave Soldering) -- 2.9 Conclusions -- References -- Chapter 3 Lead-Free Rework -- 3.1 Introduction |
| Subject |
Electronic packaging.
|
|
Solder and soldering.
|
|
solder.
|
|
Electronic packaging
|
|
Solder and soldering
|
| Form |
Electronic book
|
| ISBN |
9781119482048 |
|
1119482046 |
|
