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Electronic packaging -- Materials -- Congresses.
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Book
1992

Electronic packaging : materials and processes to reduce package cycle time and improve reliability : proceedings of the 7th Electronic Materials and Processing Congress, 24-27 August 1992, Cambridge,


Electronic Materials and Processing Congress (7th : 1992 : Cambridge, Mass.)
Materials Park, OH : ASM International, [1992]

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Location Call no. Vol. Availability
 W'PONDS  621.381046 Ele/Epm 1992  AVAILABLE
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E-journal
 

Proceedings


International Advanced Packaging Materials Symposium.


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