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Subjects (1-6 of 6)
Electronic packaging -- Materials.
1
E-book
2011

Advanced adhesives in electronics : materials, properties and applications



Cambridge, UK ; Philadelphia, PA, USA : Woodhead Pub., 2011

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2
E-book
2011

Advanced materials for thermal management of electronic packaging


Tong, Xingcun Colin.
New York : Springer, [2011]

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3
E-book
2007

Ceramic interconnect technology handbook



Boca Raton : CRC Press/Taylor & Francis, [2007]

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5
 
6
E-book
1990

Materials for high-density electronic packaging and interconnection


National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging.
Washington, D.C. : National Academy Press, 1990

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