2013

ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems : July 16-18, 2013, Burlingame, California, USA

ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2013 : Burlingame, California, USA)

New York, N.Y. : American Society of Mechanical Engineers, 2013

 

2015

ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems : collocated with the ASME 2015 13th International Conference on Nanoch

ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2015 : San Francisco, Calif.), creator

New York, N.Y. : American Society of Mechanical Engineers, 2015

 

2017

ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Pro

ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2017 : San Francisco, Calif.), creator

New York, N.Y. : American Society of Mechanical Engineers, 2017

 

2018

ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems : August 27-30, 2018, San Francisco, California, USA

ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2018 : San Francisco, Calif.), creator.

New York, N.Y. : American Society of Mechanical Engineers, 2018

 

2014

Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31,

International Conference on Packaging and Manufacturing Technology (3rd : 2013 : Brisbane Australia)

[Zurich], Switzerland : Trans Tech Publications, [2014]

 

2011

Components, packaging and manufacturing technology : selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology, Sanya, China, December 9-10

International Conference on Components, Packaging and Manufacturing Technology (2010 : Sanya Shi, China)



 

2018

Electronic packaging interconnect technology : Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : selected, peer reviewed papers from the Electronic Packaging Interconnect Technolog

Electronic Packaging Interconnect Technology Symposium (2017 : Fukuoka)

Zurich : Trans Tech Publications Ltd, [2018]

 

1992

Electronic packaging : materials and processes to reduce package cycle time and improve reliability : proceedings of the 7th Electronic Materials and Processing Congress, 24-27 August 1992, Cambridge,

Electronic Materials and Processing Congress (7th : 1992 : Cambridge, Mass.)

Materials Park, OH : ASM International, [1992]

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2005

Microscale heat transfer : fundamentals and applications

NATO Advanced Study Institute on Microscale Heat Transfer - Fundamentals and Applications in Biological and Microelectromechanical Systems (2004 : Cesme-Izmir, Turkey)



 

2006-

Proceedings

Electronics Systemintegration Technology Conference

[Los Alamitos, Calif.] : IEEE, [2006-]

 

 

Proceedings of International Symposium on Electronic Materials and Packaging

International Symposium on Electronic Materials and Packaging

Piscataway, NJ : IEEE

 

 

Proceedings of technical papers

International Microsystems, Packaging, Assembly, and Circuits Technology Conference

Piscataway, NJ : Institute of Electrical and Electronics Engineers