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Book Cover
E-book
Author Ardebili, Haleh, author

Title Encapsulation technologies for electronic applications / Haleh Ardebili, Jiawei Zhang, Michael G. Pecht
Edition Second edition
Published Oxford, United Kingdom : William Andrew, [2019]
Online access available from:
ScienceDirect eBooks    View Resource Record  
ScienceDirect eBooks    View Resource Record  

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Description 1 online resource : illustrations
Series Materials and processes for electronic applications series
Materials and processes for electronic applications series
Summary Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic
Bibliography Includes bibliographical references and index
Notes Online resource; title from PDF title page (EBSCO, viewed October 19, 2018)
Subject Electronic apparatus and appliances -- Plastic embedment
Electronic apparatus and appliances -- Plastic embedment.
TECHNOLOGY & ENGINEERING -- Mechanical.
Form Electronic book
Author Pecht, Michael, author
Zhang, Jiawei, author
ISBN 0128119799 (electronic bk.)
9780128119792 (electronic bk.)