| Description |
1 online resource |
| Series |
STP ; 1153 |
|
ASTM special technical publication ; 1153
|
| Contents |
Creep-Fatigue Damage Analysis of Solder Joints / S.H. Ju, S. Kuskowski, B.I. Sandor and M.E. Plesha -- Creep-Fatigue Interactions in Eutectic Tin-Lead Solder Alloys / Chih-Wei Kuo, Shankar M.L. Sastry and Kenneth L. Jerina -- A Unified Creep-Plasticity Theory for Solder Alloys / David L. McDowell, Matthew P. Miller and Del C. Brooks -- Thermomechanical and Fatigue Behavior of High-Temperature Lead and Lead-Free Solder Joints / Y.-H. Pao, S. Badgley, R. Govila and E. Jih -- A Model for Primary Creep of 63Sn-37Pb Solder / S.A. Schroeder, W.L. Morris, M.R. Mitchell and M.R. James -- Test Methodologies to Perform Valid Accelerated Thermomechanical Fatigue Tests of Solder Joints / Darrel R. Frear, N. Robert Sorensen and John S. Martens -- High-Cycle Fatigue of Kovar / James A. Wasynczuk, W. Dave Hanna, Franklin D. Ross and Thomas A. Freitag -- Thermal Stresses in Cooled Heat-Releasing Elements of Electronic Devices / Anatoliy Parnas |
| Notes |
"ASTM publication code number (PCN): 04-011530-30." |
|
"Contains papers presented at the symposium of the same name held in Atlanta, Georgia on 17 May 1993 ... sponsored by Committee E-8 on Fatigue and Fracture"--Foreword |
| Bibliography |
Includes bibliographical references and index |
| Subject |
Electronics -- Materials -- Creep.
|
|
Electronics -- Materials -- Fatigue.
|
| Genre/Form |
Conference papers and proceedings.
|
| Form |
Electronic book
|
| Author |
Mitchell, M. R. (Michael R.), 1941-
|
|
Schroeder, Scott A.
|
|
ASTM Committee E-8 on Fatigue and Fracture.
|
|
ASTM International.
|
| ISBN |
0803119941 |
|
0803152604 |
|
9780803119949 |
|
9780803152601 |
|
