Title Thermal conductivity 33 : thermal expansion 21 : joint conferences, May 15-18, 2017, Logan, Utah, USA / Heng Ban [editor]

Published Lancaster, PA : DEStech Publications, 2018

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Description 1 online resource (xi, 265 pages) Bibliography Includes bibliographical references and author index Notes Description based on print version record Subject Heat -- Conduction -- Congresses Heat -- Conduction -- Measurement -- Methodology -- Congresses Materials -- Thermal properties -- Congresses Materials -- Thermal properties -- Measurement -- Methodology -- Congresses Expansion (Heat) -- Congresses Expansion (Heat) -- Measurement -- Methodology -- Congresses Expansion (Heat) Heat -- Conduction. Materials -- Thermal properties. Genre/Form Conference papers and proceedings. Form Electronic book Author Ban, Heng, editor International Thermal Expansion Symposium (21st : 2017 : Logan, Utah) ISBN 9781523153800 1523153806

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